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74AC11240PWRE4

Texas Instruments

74AC11240PWRE4 by Texas Instruments

74AC11240PWRE4 by Texas Instruments is a Bus Driver & Transceiver with 8.4ns Propagation Delay, 24 Amp Max I (ol), and -40 to 85°C Operating Temperature range. It is ideal for industrial applications requiring a compact design and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,066 parts In-Stock

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8,066

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Digiode

USA . 3,148 parts In-Stock

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3,148

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Distributors (Availability)

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Native Components

USA . 807 parts In-Stock

1+ parts

$1.320

100+ parts

-

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807

$1.320

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Northwest PG Solutions

USA . 248 parts In-Stock

1+ parts

$1.452

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-

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248

$1.452

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One Stop Electronics

USA . 504 parts In-Stock

1+ parts

$4.000

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504

$4.000

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AZTECH Wire

Italy . 334 parts In-Stock

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$8.607

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334

$8.607

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Parana Technologies

USA . 1,405 parts In-Stock

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$13.329

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$13.838

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1,405

$13.329

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$13.838

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DigiPath Technology Company

USA . 1,060 parts In-Stock

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$14.676

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$14.676

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ChromeModa Solutions

Germany . 2,561 parts In-Stock

1+ parts

$14.976

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$12.280

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2,561

$14.976

$12.280

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$14.976

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$14.227

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$13.478

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1,709

$14.976

$14.227

$13.478

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Andel Nordic

Denmark . 402 parts In-Stock

1+ parts

$59.980

100+ parts

-

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$57.581

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$57.581

402

$59.980

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$57.581

$57.581

Component Stockers USA

USA . 323 parts In-Stock

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$99.990

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Microchip USA

USA . 6,621 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,018 parts In-Stock

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Corphita

USA . 2,767 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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$17.224

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$15.949

10k+ parts

$15.949

100

-

$17.224

$15.949

$15.949

Overview

Enhance the efficiency and reliability of your electronic designs with the 74AC11240PWRE4 from Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers top-tier quality and performance. This bus driver & transceiver is perfect for a wide range of applications, providing seamless data transmission and optimal signal integrity. With its advanced features and dependable functionality, this product offers exceptional value and benefits to customers looking to elevate their projects to the next level. Upgrade your designs today with the 74AC11240PWRE4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand rough handling, making this product ideal for use in demanding environments.

Propagation Delay At Nominal Supply: 8.4 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed communication and data transfer applications.

Surface Mount: YES

Surface mount capability offers easy installation and space-saving design, making it convenient for integration into compact bus driver systems.

No. of Functions: 2

Having multiple functions allows for versatility and flexibility in operation, making this product suitable for various bus communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, ensuring compatibility with most systems and power sources.

Output Characteristics: 3-STATE

3-STATE output allows for tristate operation, providing greater control and flexibility in managing bus communication lines.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers 74AC11240PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

8.4 ns

Propagation Delay (tpd):

11.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74AC11240PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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