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X0202DN

STMicroelectronics

X0202DN by STMicroelectronics

X0202DN by STMicroelectronics is a single SCR in a compact rectangular package, ideal for surface mount applications. It supports a max on-state current of 1.4 A and handles repetitive peak reverse voltages up to 400 V. Operating b/w -40 °C to 125°C, it’s perfect for robust electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,939 parts In-Stock

1+ parts

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3,939

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Vyrian

USA . 3,562 parts In-Stock

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3,562

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Anansix

USA . 301 parts In-Stock

1+ parts

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301

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,095 parts In-Stock

1+ parts

$3.674

100+ parts

-

1k+ parts

$3.306

10k+ parts

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2,095

$3.674

-

$3.306

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MKK Technologies

India . 172 parts In-Stock

1+ parts

$6.908

100+ parts

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172

$6.908

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DigiPath Technology Company

USA . 172 parts In-Stock

1+ parts

$6.908

100+ parts

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172

$6.908

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Corphita

USA . 3,445 parts In-Stock

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3,445

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Parana Technologies

USA . 459 parts In-Stock

1+ parts

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100+ parts

$4.392

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459

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$4.392

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Overview

Unlock the power of precision with the X0202DN from STMicroelectronics, a leader in innovative semiconductor solutions. This Silicon Controlled Rectifier (SCR) is designed to enhance efficiency and reliability in diverse applications, from industrial control systems to consumer electronics. With superior performance and robust construction, it ensures minimal leakage and maximum durability, making it a smart choice for engineers seeking quality and value in their designs. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent thermal stability and makes the component lightweight, ensuring durability in various applications.

Maximum DC Gate Trigger Current: 0.2 mA

A low gate trigger current allows for lower power consumption in triggering the SCR, making it efficient for battery-operated devices.

Configuration: SINGLE

Single configuration simplifies setup, making it easy to integrate into circuit designs.

Non Repetitive Peak On-state Current: 25 A

Capable of handling high peak currents, making it suitable for applications requiring robust performance under surge conditions.

Surface Mount: YES

Surface mount capability allows for automated assembly, reducing manufacturing costs and increasing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of space on PCBs, optimizing layout for compact designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and solderability, enhancing reliability in electronic assemblies.

Maximum On-state Current: 1.4 A

This current rating ensures reliable operation in typical load conditions, making it suitable for a wide array of applications.

Maximum Leakage Current: 0.005 mA

Very low leakage current ensures minimal power loss and enhances efficiency in energy-sensitive applications.

Repetitive Peak Reverse Voltage: 400 V

High reverse voltage tolerance allows the SCR to be used in harsh environments, adding versatility to its application.

No. of Terminals: 4

Four terminals provide flexibility in circuit design and configuration options, accommodating various layouts.

Package Style (Meter): SMALL OUTLINE

Compact package style is ideal for space-constrained designs, making it suitable for high-density applications.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in high-heat environments, extending the product's lifespan.

Trigger Device Type: SCR

Utilizing SCR technology allows for efficient control of high voltage and current applications, enhancing performance.

Minimum Operating Temperature: -40 °C

Wide operational temperature range makes the product suitable for extreme environments and varying climatic conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistive properties, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions facilitate versatile mounting options, providing more flexibility in circuit design.

Maximum RMS On-state Current: 1.4 A

Efficient handling of RMS currents supports various load types, enhancing overall performance in diverse applications.

Maximum DC Gate Trigger Voltage: 0.8 V

Low trigger voltage requirement minimizes energy consumption while ensuring reliable turn-on performance.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage provides robust durability against voltage spikes, ensuring component reliability in high-voltage applications.

Maximum Holding Current: 5 mA

A low holding current allows for efficient operation under varying loads, ensuring stability in switching applications.

Technical Specifications

Silicon Controlled Rectifiers (SCR) X0202DN attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

Non Repetitive Peak On-state Current:

25 A

No. of Elements:

1

No. of Terminals:

4

Maximum On-state Current:

1.4 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1.4 A

Repetitive Peak Off-state Voltage:

400 V

Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

X0202DN Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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