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VNQ830E-E

STMicroelectronics

VNQ830E-E by STMicroelectronics

VNQ830E-E by STMicroelectronics is a versatile peripheral driver with a max output current of 2 A and supports power supplies from 8 to 36 V. Its compact SO package features nickel palladium gold terminals, ideal for space-constrained applications. This device excels in buffering or inverting signals efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,031 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,031

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Digiode

USA . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,851

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Anansix

USA . 629 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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629

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,768 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

$2.043

10k+ parts

-

1,768

$2.270

-

$2.043

-

MKK Technologies

India . 2,061 parts In-Stock

1+ parts

$4.268

100+ parts

-

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10k+ parts

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2,061

$4.268

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DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$4.268

100+ parts

-

1k+ parts

-

10k+ parts

-

2,061

$4.268

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-

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$11.570

100+ parts

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546

$11.570

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Ampacity Inc.

Singapore . 379 parts In-Stock

1+ parts

$34.500

100+ parts

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10k+ parts

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379

$34.500

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 18,429 parts In-Stock

1+ parts

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18,429

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Microchip USA

USA . 4,200 parts In-Stock

1+ parts

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4,200

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Parana Technologies

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

$2.714

1k+ parts

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10k+ parts

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1,379

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$2.714

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Corphita

USA . 1,282 parts In-Stock

1+ parts

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1,282

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Overview

Elevate your designs with the VNQ830E-E from STMicroelectronics, a trusted leader in innovation. This robust peripheral driver seamlessly supports a wide range of applications, from automotive systems to industrial automation, ensuring reliability and performance. With its superior build quality and exceptional current handling capabilities, it empowers engineers to create efficient, cutting-edge solutions that stand the test of time. Experience unmatched value and peace of mind with every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability in various environments, making it suitable for a wide range of applications.

Surface Mount: YES

With surface mount technology, this product offers easy integration into compact designs, saving space on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, enabling better layout flexibility in design.

Power Supplies (V): 8/36

The wide power supply range makes this peripheral driver versatile for different voltage requirements in various applications.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and functionality options, making this driver suitable for complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving board space and allows for higher component density on PCBs.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent corrosion resistance and enhances solderability, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options and better connectivity in various circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting a maximum reflow time of 30 seconds ensures compatibility with modern soldering processes, facilitating mass production.

Peak Reflow Temperature °C: 250

The driver can withstand high reflow temperatures, ensuring robustness and reliability during assembly without damage.

Maximum Output Current: 2 A

A maximum output current of 2 A offers sufficient current handling for driving peripherals effectively without overheating.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easier to solder, enhancing assembly reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, enabling compatibility with various PCB designs.

Driver No. of Bits: 4

With 4 bits, this driver allows for discrete control over devices, providing flexibility in application design.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, making proper handling during storage and assembly critical for reliability.

Nominal Output Peak Current Limit: 13.5 A

A nominal output peak current limit of 13.5 A ensures the driver can handle high-demand applications with ease.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatility allows the driver to be used in various interfacing applications, enhancing its usability across different projects.

Output Current Flow Direction: SINK

The ability to sink current enables efficient control of connected devices, making it ideal for driving loads in a variety of applications.

Technical Specifications

Peripheral Drivers VNQ830E-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

13.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VNQ830E-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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