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VND5E025LK-E

STMicroelectronics

VND5E025LK-E by STMicroelectronics

VND5E025LK-E by STMicroelectronics is a half-bridge peripheral driver with a max output current of 3 A, operating b/w 8-28 V. It features a compact 24-terminal SO package and supports surface mount technology. Ideal for driving motors and actuators in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,927 parts In-Stock

1+ parts

-

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5,927

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Digiode

USA . 3,578 parts In-Stock

1+ parts

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3,578

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Anansix

USA . 722 parts In-Stock

1+ parts

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722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 241 parts In-Stock

1+ parts

$3.273

100+ parts

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241

$3.273

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$11.366

100+ parts

-

1k+ parts

$10.229

10k+ parts

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2,378

$11.366

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$10.229

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AZTECH Wire

Italy . 163 parts In-Stock

1+ parts

$19.060

100+ parts

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163

$19.060

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MKK Technologies

India . 734 parts In-Stock

1+ parts

$21.372

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734

$21.372

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DigiPath Technology Company

USA . 734 parts In-Stock

1+ parts

$21.372

100+ parts

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734

$21.372

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Component Stockers USA

USA . 226 parts In-Stock

1+ parts

$99.990

100+ parts

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226

$99.990

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A-Z Elektronik GmbH

Germany . 5,646 parts In-Stock

1+ parts

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5,646

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Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

$13.589

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1,433

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$13.589

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Corphita

USA . 136 parts In-Stock

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136

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Overview

Unlock new possibilities with the VND5E025LK-E from STMicroelectronics, a top-tier peripheral driver designed for reliability and efficiency. With its robust performance in diverse applications—from automotive to industrial automation—this compact solution maximizes power management while minimizing space. Benefit from STMicroelectronics’ trusted expertise, ensuring quality and innovation at every turn. Elevate your projects with unmatched value and a commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the internal components, making the driver suitable for varied environments.

Surface Mount: YES

Surface mount capability allows for efficient and compact board layouts, optimizing space in your design.

Package Shape: RECTANGULAR

The rectangular package shape is versatile, making it easy to integrate into different board designs and applications.

Power Supplies (V): 8/28

The wide voltage range enables compatibility with various power supply systems, enhancing versatility in different applications.

No. of Terminals: 24

With 24 terminals, this driver can handle multiple connections, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on the PCB, making it ideal for compact designs.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for improved layout options and easier routing on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures that the component can withstand soldering processes without damage.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this driver can endure high-temperature soldering techniques, enhancing reliability.

Maximum Output Current: 3 A

The maximum output current of 3 A allows the driver to control high-power devices, making it suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide mechanical stability, improving assembly efficiency.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density designs, enabling the integration of more functions into compact spaces.

Driver No. of Bits: 2

Having 2 bits in the driver allows for precise control of outputs, which is advantageous for complex applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for a reliable shelf-life without special packaging.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

As a half bridge-based peripheral driver, the IC can efficiently manage the control and driving of motors and solenoids.

Output Current Flow Direction: SINK

The sink output current flow direction allows for effective management of load currents, improving overall circuit performance.

Technical Specifications

Peripheral Drivers VND5E025LK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5E025LK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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