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VN772K

STMicroelectronics

VN772K by STMicroelectronics

VN772K by STMicroelectronics is a versatile brush DC motor controller with a max output current of 12 A and operates b/w 5.5 V to 36 V. Its compact SO package (7.5 mm x 17.9 mm) ensures efficient surface mounting in motion control applications. Designed for reliability, it features nickel-palladium-gold terminals and a peak reflow temp of 250 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,319 parts In-Stock

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12,319

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Anansix

USA . 2,231 parts In-Stock

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Digiode

USA . 676 parts In-Stock

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676

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Zilex Electronics Inc.

Canada . 614 parts In-Stock

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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28

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Microchip USA

USA . 125 parts In-Stock

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$7.932

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125

$7.932

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IDEA Electronic Components Group

UK . 326 parts In-Stock

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$14.518

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$13.066

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326

$14.518

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$13.066

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AZTECH Wire

Italy . 576 parts In-Stock

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$15.680

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576

$15.680

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MKK Technologies

India . 911 parts In-Stock

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$27.299

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911

$27.299

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DigiPath Technology Company

USA . 911 parts In-Stock

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$27.299

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911

$27.299

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A-Z Elektronik GmbH

Germany . 4,547 parts In-Stock

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Corphita

USA . 3,945 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,351 parts In-Stock

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$17.358

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unlock seamless motion control with the VN772K from STMicroelectronics, a trusted leader in innovation. This compact brush DC motor controller delivers exceptional performance and reliability, perfect for a range of applications from robotics to automation. With its robust design and advanced features, it ensures precision and efficiency, giving you the competitive edge. Experience the quality and support that come with STMicroelectronics, ensuring your projects thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Surface mount technology ensures a compact design and simpler assembly process, making it ideal for modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the PCB, allowing for efficient circuit design.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V balances efficiency and performance, suitable for a wide range of applications.

No. of Terminals: 28

Having 28 terminals allows for extensive functionality and connectivity options in controlling motors.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces PCB space requirements, facilitating more compact electronic designs.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent reliability and reduces oxidation, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning improves electrical performance and layout flexibility on PCB designs.

Maximum Seated Height: 2.65 mm

A low seated height enables this IC to fit in space-constrained applications without compromising performance.

Width: 7.5 mm

A compact width allows for higher integration density, essential for portable and space-efficient designs.

Other IC type: BRUSH DC MOTOR CONTROLLER

As a brush DC motor controller, this IC is specifically designed for efficient motor control applications.

Minimum Supply Voltage (Vsup): 5.5 V

The minimum supply voltage supports a wide range of power supply options, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Allowable peak reflow processing time of 30 seconds helps in ensuring reliable solder joints during manufacturing.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures compatibility with high-temperature soldering processes.

Length: 17.9 mm

A manageable length of 17.9 mm allows for flexible designs, fitting into various device layouts.

Maximum Output Current: 12 A

With a maximum output current of 12 A, this IC supports powerful motor operations, making it suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and solder joint reliability, crucial for maintaining connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layouts while maintaining ease of assembly and soldering.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 signifies moderate sensitivity to moisture, allowing for careful handling during the manufacturing process.

Maximum Supply Voltage (Vsup): 36 V

High maximum supply voltage at 36 V expands application possibilities, accommodating high-power motor control tasks.

Technical Specifications

Motion Control ICs VN772K attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Output Current:

12 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

VN772K Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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