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VN772K13TR

STMicroelectronics

VN772K13TR by STMicroelectronics

VN772K13TR by STMicroelectronics is a compact brush DC motor controller with a max output current of 12 A and operates b/w 5.5 V to 36 V. It features a small outline package (7.5 mm x 17.9 mm) for efficient surface mounting. Ideal for motion control applications, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,806 parts In-Stock

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8,806

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Anansix

USA . 2,509 parts In-Stock

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2,509

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Digiode

USA . 624 parts In-Stock

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624

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Distributors (Availability)

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Microchip USA

USA . 150 parts In-Stock

1+ parts

$4.812

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150

$4.812

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AZTECH Wire

Italy . 43 parts In-Stock

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$16.480

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43

$16.480

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IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$18.849

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$16.964

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2,260

$18.849

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$16.964

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MKK Technologies

India . 747 parts In-Stock

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$35.444

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747

$35.444

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DigiPath Technology Company

USA . 747 parts In-Stock

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$35.444

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747

$35.444

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A-Z Elektronik GmbH

Germany . 6,810 parts In-Stock

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6,810

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Parana Technologies

USA . 1,759 parts In-Stock

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$22.537

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1,759

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$22.537

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 701 parts In-Stock

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701

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Overview

Unlock the full potential of your motion control applications with the VN772K13TR from STMicroelectronics. Renowned for its innovative solutions, STMicroelectronics delivers unparalleled quality and reliability in this compact brush DC motor controller. Experience efficient power management and seamless performance enhancement, perfect for robotics, automotive, and industrial automation. Elevate your projects with cutting-edge technology that ensures durability and maximizes operational efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and robustness, making the IC suitable for various environmental conditions.

Surface Mount: YES

Surface mount configuration allows for compact design and easier integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape offers efficient space utilization on PCB, enabling higher density layouts.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V provides a reliable operating point for effective performance in numerous applications.

Power Supplies (V): 8/36

The versatile power supply range from 8V to 36V accommodates various system requirements and configurations, enhancing flexibility.

No. of Terminals: 28

With 28 terminals, this IC offers extensive connectivity options for comprehensive integration into complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements, making it ideal for compact electronic designs.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances conductivity and protects against corrosion, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positioning allows for effective heat dissipation and supports flexible layout designs on PCBs.

Maximum Seated Height: 2.65 mm

A low maximum seated height supports low-profile designs in space-constrained applications.

Width: 7.5 mm

The compact width contributes to space-efficient PCB layouts, allowing for more components within a given area.

Other IC type: BRUSH DC MOTOR CONTROLLER

Being a brush DC motor controller makes this IC suitable for a wide range of motor control applications, enhancing versatility.

Minimum Supply Voltage (Vsup): 5.5 V

The low minimum supply voltage of 5.5 V enables compatibility with a variety of power sources, increasing design options.

Length: 17.9 mm

The short length contributes to high-density PCB designs, allowing for the accommodation of more functionalities.

Maximum Supply Current (Isup): 7 mA

The low maximum supply current ensures efficient operation and minimizes power consumption in the design.

Maximum Output Current: 12 A

The high maximum output current of 12 A enables control of larger motors and higher torque applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering reliability and enhances mechanical stability on PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with standard PCB layouts, simplifying manufacturing and assembly.

Maximum Supply Voltage (Vsup): 36 V

The high maximum supply voltage of 36 V broadens application possibilities, making it suitable for demanding motor control tasks.

Technical Specifications

Motion Control ICs VN772K13TR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Output Current:

12 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

VN772K13TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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