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VN770

STMicroelectronics

VN770 by STMicroelectronics

STMicroelectronics' VN770 is a Motion Control IC with 4 functions, supporting Brush DC Motor Controller. It operates at 6-26V, delivering up to 9A output current. This small outline IC in plastic/epoxy package is ideal for motion control applications requiring precise voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,816 parts In-Stock

1+ parts

-

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3,816

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Anansix

USA . 1,841 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,841

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Digiode

USA . 996 parts In-Stock

1+ parts

-

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996

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$21.084

100+ parts

-

1k+ parts

$18.975

10k+ parts

-

780

$21.084

-

$18.975

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MKK Technologies

India . 798 parts In-Stock

1+ parts

$39.646

100+ parts

-

1k+ parts

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10k+ parts

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798

$39.646

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DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$39.646

100+ parts

-

1k+ parts

-

10k+ parts

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798

$39.646

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-

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Corphita

USA . 662 parts In-Stock

1+ parts

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662

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Parana Technologies

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$25.209

1k+ parts

-

10k+ parts

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7

-

$25.209

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Overview

Unlock the power of precise motion control with the STMicroelectronics VN770. Crafted by a renowned manufacturer, this brush DC motor controller offers impeccable quality and reliability. Ideal for a wide range of applications, from robotics to automotive systems, the VN770 delivers unparalleled performance and efficiency. Experience seamless operation and enhanced functionality with this compact and versatile Motion Control IC. Elevate your projects with the VN770 and unleash its full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and insulation, making the product resistant to external elements and prolonging its lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one IC simplifies the overall design of the system, reducing the need for additional components and improving overall efficiency.

Nominal Supply Voltage (Vsup): 13 V

Operating within the range of 6V to 26V, the product is versatile and compatible with a wide range of power sources.

No. of Terminals: 28

With a high number of terminals, the IC offers flexibility in connecting to various components, enhancing the overall functionality of the system.

Maximum Output Current: 9 A

Capable of handling a high output current of 9A, the IC can power demanding applications, providing reliable and efficient performance.

Technical Specifications

Motion Control ICs VN770 attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

4

No. of Terminals:

28

Maximum Output Current:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

VN770 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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