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VN540SP13TR-E

STMicroelectronics

VN540SP13TR-E by STMicroelectronics

STMicroelectronics' VN540SP13TR-E is a 10-terminal peripheral driver with built-in protections for over current, thermal, and under voltage. It operates b/w 10-36V, making it suitable for various applications requiring SOURCE output current flow direction in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,648

-

-

-

-

Digiode

USA . 3,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,305

-

-

-

-

Anansix

USA . 2,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,655

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,474 parts In-Stock

1+ parts

$8.864

100+ parts

-

1k+ parts

$7.978

10k+ parts

-

1,474

$8.864

-

$7.978

-

MKK Technologies

India . 2,133 parts In-Stock

1+ parts

$16.669

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

$16.669

-

-

-

DigiPath Technology Company

USA . 2,133 parts In-Stock

1+ parts

$16.669

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

$16.669

-

-

-

Corphita

USA . 3,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,353

-

-

-

-

Parana Technologies

USA . 1,141 parts In-Stock

1+ parts

-

100+ parts

$10.598

1k+ parts

-

10k+ parts

-

1,141

-

$10.598

-

-

Overview

Unleash the power of innovation with the VN540SP13TR-E by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-notch quality and reliability in their peripheral drivers. This versatile component is perfect for a wide range of applications, offering built-in protections such as overcurrent, thermal, and undervoltage. With a maximum supply voltage of 36V and a compact package style, this product provides exceptional value and performance to customers seeking cutting-edge solutions for their projects. Elevate your designs with the VN540SP13TR-E and experience the difference that STMicroelectronics can make in your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability makes for easy and efficient installation on circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 36 V

High maximum supply voltage allows for compatibility with a wide range of systems and applications.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Built-in protections ensure safety and reliability by preventing damage from over current, thermal issues, and under voltage conditions.

No. of Terminals: 10

With 10 terminals, this peripheral driver offers flexibility and connectivity for various input and output configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs and applications with limited space.

Minimum Supply Voltage: 10 V

The low minimum supply voltage allows for operation in systems with lower power requirements, improving energy efficiency.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options, enhancing reliability and ease of use.

Maximum Seated Height: 3.75 mm

The low maximum seated height helps in maintaining a slim profile for the product, making it suitable for applications with space constraints.

Width: 7.5 mm

The compact width of 7.5 mm allows for efficient use of space on the circuit board, enabling more components to be packed closely together.

Length: 9.4 mm

The length of 9.4 mm provides a balanced form factor, making the product versatile and suitable for various enclosure designs.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections on the circuit board, ensuring reliable performance.

Terminal Pitch: 1.27 mm

The tight terminal pitch of 1.27 mm allows for high-density mounting on the circuit board, saving space and improving overall system efficiency.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type offers versatility and compatibility with various digital signal processing requirements, making it a suitable choice for diverse applications.

Output Current Flow Direction: SOURCE

The source output current flow direction provides ease of integration with other components in the system, ensuring seamless operation and performance.

Technical Specifications

Peripheral Drivers VN540SP13TR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN540SP13TR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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