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VN540SP13TR

STMicroelectronics

VN540SP13TR by STMicroelectronics

STMicroelectronics' VN540SP13TR is a 10-terminal peripheral driver with built-in protections for over current, thermal, and under voltage. It operates within a supply voltage range of 10-36V and has a compact rectangular package style suitable for surface mount applications. Ideal for buffer or inverter-based interface ICs, this driver directs output current flow in the source direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,712 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,712

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-

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Anansix

USA . 1,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,629

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Vyrian

USA . 1,226 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$7.196

100+ parts

-

1k+ parts

$6.477

10k+ parts

-

692

$7.196

-

$6.477

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MKK Technologies

India . 856 parts In-Stock

1+ parts

$13.532

100+ parts

-

1k+ parts

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10k+ parts

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856

$13.532

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DigiPath Technology Company

USA . 856 parts In-Stock

1+ parts

$13.532

100+ parts

-

1k+ parts

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10k+ parts

-

856

$13.532

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-

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Corphita

USA . 4,452 parts In-Stock

1+ parts

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4,452

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Parana Technologies

USA . 1,239 parts In-Stock

1+ parts

-

100+ parts

$8.604

1k+ parts

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10k+ parts

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1,239

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$8.604

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Overview

Enhance the performance of your electronic projects with the VN540SP13TR by STMicroelectronics. This high-quality peripheral driver offers reliable protection against overcurrent, thermal issues, and undervoltage situations. With a wide supply voltage range and compact design, it is perfect for a variety of applications. Trust in STMicroelectronics' reputation for top-notch manufacturing and unlock the potential of your designs with this versatile and efficient component. Upgrade your projects today and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product ideal for applications where weight is a concern.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 36 V

High maximum supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in various electronic setups.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to integrate into existing designs and ensures efficient use of space on circuit boards.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Built-in protections ensure the safety and reliability of the product by safeguarding against potential damage from overcurrent, thermal issues, and undervoltage conditions.

No. of Terminals: 10

Having 10 terminals allows for versatile connectivity options, accommodating a variety of input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and offers a compact solution for applications with size constraints.

Minimum Supply Voltage: 10 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in different operating environments.

Terminal Position: DUAL

Dual terminal positions offer redundancy and flexibility in connecting the peripheral driver, enhancing reliability and ease of installation.

Maximum Seated Height: 3.75 mm

Low maximum seated height allows for a slim profile, making the product suitable for applications where space is limited.

Width: 7.5 mm

Narrow width of 7.5 mm ensures compatibility with standard spacing on circuit boards and facilitates easy integration into tight layouts.

Length: 9.4 mm

Compact length of 9.4 mm helps in saving space on the circuit board, making the product suitable for applications with size constraints.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and ease of assembly, ensuring reliable electrical connections in the product.

Terminal Pitch: 1.27 mm

Close terminal pitch of 1.27 mm allows for dense packing on the circuit board, maximizing space utilization and enabling high-density designs.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type provides flexibility in signal processing and compatibility with various input/output requirements, improving product versatility.

Output Current Flow Direction: SOURCE

Output current sourced from the peripheral driver simplifies circuit design and ensures consistent signal delivery, enhancing overall system performance.

Technical Specifications

Peripheral Drivers VN540SP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN540SP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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