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VN330SP(8932)TR

STMicroelectronics

VN330SP(8932)TR by STMicroelectronics

VN330SP(8932)TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 4 functions. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications requiring reliable control in compact designs, it offers a max output current of 0.5A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,524 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,524

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-

-

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Vyrian

USA . 1,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,480

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-

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Anansix

USA . 1,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,178

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,577 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

$9.945

10k+ parts

-

1,577

$11.050

-

$9.945

-

MKK Technologies

India . 96 parts In-Stock

1+ parts

$20.779

100+ parts

-

1k+ parts

-

10k+ parts

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96

$20.779

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DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

$20.779

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$20.779

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-

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Parana Technologies

USA . 1,719 parts In-Stock

1+ parts

-

100+ parts

$13.212

1k+ parts

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10k+ parts

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1,719

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$13.212

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Corphita

USA . 1,585 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,585

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Overview

Unlock the potential of your projects with the VN330SP(8932)TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile peripheral driver boasts exceptional reliability with built-in protections against overcurrent, thermal issues, and undervoltage, ensuring robust performance in diverse applications, from automotive to industrial automation. Experience enhanced efficiency and peace of mind, knowing you're backed by a manufacturer renowned for quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable construction, ensuring reliability in various environments.

Surface Mount: YES

The surface mount capability allows for easier integration into compact electronic designs, promoting efficiency in space utilization.

Maximum Supply Voltage: 36 V

A high maximum supply voltage makes this peripheral driver suitable for a wide range of applications, accommodating voltage variations.

No. of Functions: 4

With four functions, this product offers versatility, making it adaptable to various driver requirements.

Package Shape: RECTANGULAR

The rectangular package shape contributes to optimized layout options on PCBs, simplifying design implementation.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protection features enhance device reliability and longevity by safeguarding against common electrical faults.

Power Supplies (V): 24

Operating at 24V ensures compatibility with standard power supplies, making it a practical choice for many applications.

No. of Terminals: 10

Ten terminals provide sufficient connection points for versatile and complex circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with a heat sink/slug provides effective thermal management, promoting efficient operation even under load.

Minimum Supply Voltage: 10 V

A low minimum supply voltage broadens the range of compatible power sources, simplifying design constraints.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on circuit boards and enhances assembly efficiency.

Maximum Seated Height: 3.75 mm

A compact seated height makes this driver suitable for low-profile applications where space is a concern.

Width: 7.5 mm

A narrow width aids in dense layout designs, allowing for efficient space usage in multi-component assemblies.

Length: 9.4 mm

The moderate length supports compact designs while providing enough space for reliable routing and connectivity.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A allows for effective drive capability suitable for many peripheral devices.

Terminal Form: GULL WING

Gull wing terminals provide a reliable mechanical and electrical connection, ensuring stability and ease of soldering.

Nominal Supply Voltage: 24 V

The nominal voltage aligns with commonly used standards, ensuring compatibility and ease of use in various applications.

Turn-on Time: 60 us

A short turn-on time enhances responsiveness, making this driver ideal for fast-switching applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB design and facilitates integration with other components.

Driver No. of Bits: 4

Four bits provide the necessary resolution for diverse control applications, increasing the product's versatility.

Nominal Output Peak Current Limit: 4 A

The high peak current limit allows for short bursts of power, accommodating dynamic loading conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being based on buffer or inverter technology enhances signal integrity and enables seamless integration into digital systems.

Turn-off Time: 40 us

Fast turn-off times improve circuit efficiency and reduce power dissipation during transitions.

Output Current Flow Direction: SOURCE

The source direction ensures direct drive capabilities, simplifying connections with load devices.

Technical Specifications

Peripheral Drivers VN330SP(8932)TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

4

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

40 us

Turn-on Time:

60 us

Width:

7.5 mm

Trade Compliance

VN330SP(8932)TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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