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VN330SP(8932)

STMicroelectronics

VN330SP(8932) by STMicroelectronics

VN330SP(8932) by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports up to 4 functions. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications requiring reliable control in compact designs, it offers a max output current of 0.5A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,262 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,262

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-

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Digiode

USA . 3,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,419

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Anansix

USA . 2,421 parts In-Stock

1+ parts

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10k+ parts

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2,421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 18 parts In-Stock

1+ parts

$7.494

100+ parts

-

1k+ parts

$6.745

10k+ parts

-

18

$7.494

-

$6.745

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MKK Technologies

India . 1,780 parts In-Stock

1+ parts

$14.093

100+ parts

-

1k+ parts

-

10k+ parts

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1,780

$14.093

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$14.093

100+ parts

-

1k+ parts

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10k+ parts

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1,780

$14.093

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Corphita

USA . 2,052 parts In-Stock

1+ parts

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2,052

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Parana Technologies

USA . 969 parts In-Stock

1+ parts

-

100+ parts

$8.961

1k+ parts

-

10k+ parts

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969

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$8.961

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Overview

Transform your designs with the VN330SP(8932) from STMicroelectronics, a powerhouse in peripheral drivers renowned for reliability and innovation. This compact solution delivers robust performance with built-in protections, ensuring safety while driving efficiency in diverse applications like automotive, industrial automation, and consumer electronics. Trust in STMicroelectronics’ legacy of excellence to unlock new possibilities and elevate your projects with unmatched quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package material ensures longevity and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36 V, this driver can accommodate a wide range of applications, enhancing flexibility.

No. of Functions: 4

Offering four functions in a single package optimizes PCB space and reduces component count.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient layout in circuit designs, facilitating better space utilization.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections against overcurrent, thermal issues, and undervoltage enhance safety and reliability.

Power Supplies (V): 24

Designed for 24 V power supplies, making it compatible with standard power systems in various applications.

No. of Terminals: 10

Ten terminals provide ample connection options, supporting versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with a heat sink or slug improves thermal management, ensuring optimal performance.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10 V allows for operation in low-voltage applications, increasing usability.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and corrosion resistance for improved long-term performance.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design and can simplify routing on the board.

Maximum Seated Height: 3.75 mm

A maximum seated height of 3.75 mm facilitates low-profile designs, ideal for space-constrained applications.

Width: 7.5 mm

Narrow width allows for tight packing of components on the PCB, enhancing overall design efficiency.

Length: 9.4 mm

A shorter length supports compact layouts and reduces board real estate usage.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A makes it suitable for driving peripheral devices effectively.

Terminal Form: GULL WING

Gull wing terminal form ensures good mechanical support and reliable solder joints.

Nominal Supply Voltage: 24 V

A nominal supply voltage of 24 V aligns with prevalent industry standards, simplifying design processes.

Turn-on Time: 60 us

Fast turn-on time of 60 µs contributes to responsive system performance in real-time applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides compatibility with standard PCB layouts.

Driver No. of Bits: 4

With four bits, this driver can control multiple devices or functions, enhancing system capabilities.

Nominal Output Peak Current Limit: 4 A

The peak current limit of 4 A accommodates high-demand applications, ensuring robust operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer/inverter based driver enables integration with various IC types, broadening application scope.

Turn-off Time: 40 us

Quick turn-off time of 40 µs allows for efficient power management in dynamic applications.

Output Current Flow Direction: SOURCE

Source output current direction is ideal for driving loads, providing enhanced control and flexibility.

Technical Specifications

Peripheral Drivers VN330SP(8932) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

4

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

40 us

Turn-on Time:

60 us

Width:

7.5 mm

Trade Compliance

VN330SP(8932) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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