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VN330SP

STMicroelectronics

VN330SP by STMicroelectronics

STMicroelectronics' VN330SP is a 4-function peripheral driver with built-in protections. It operates at a supply voltage range of 10-36V and can handle a max output current of 0.5A. Ideal for applications requiring buffer or inverter-based interface ICs, this driver comes in a small outline package with dual terminals and matte tin finish.

Median Price

$15.310

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 19 parts In-Stock

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$15.310

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19

$15.310

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Chip Stock

USA . 25,500 parts In-Stock

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25,500

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Vyrian

USA . 3,333 parts In-Stock

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3,333

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Digiode

USA . 3,000 parts In-Stock

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3,000

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ComSIT Distribution GmbH

Germany . 1,176 parts In-Stock

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1,176

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Anansix

USA . 274 parts In-Stock

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274

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Digital Electronic Gebert Verwaltungs UG

Germany . 27 parts In-Stock

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27

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Huijzer Components

Netherlands . 10 parts In-Stock

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10

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ECAB

Sweden . 7 parts In-Stock

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7

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Electronics Depot

USA . 2 parts In-Stock

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2

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LittleDiode

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$6.511

100+ parts

-

1k+ parts

$5.860

10k+ parts

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1,753

$6.511

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$5.860

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Microchip USA

USA . 380 parts In-Stock

1+ parts

$9.195

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380

$9.195

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MKK Technologies

India . 383 parts In-Stock

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$12.243

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383

$12.243

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DigiPath Technology Company

USA . 383 parts In-Stock

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$12.243

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383

$12.243

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AZTECH Wire

Italy . 807 parts In-Stock

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$16.830

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807

$16.830

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Emar International I/E

Canada . 8,865 parts In-Stock

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RC Electronics

USA . 5,400 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,581 parts In-Stock

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1,581

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Corphita

USA . 1,043 parts In-Stock

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1,043

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Kepictronics

USA . 521 parts In-Stock

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521

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Parana Technologies

USA . 505 parts In-Stock

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$7.785

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505

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$7.785

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Assy Fe

Spain . 224 parts In-Stock

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224

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iodParts Technologies Inc.

India . 37 parts In-Stock

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37

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Overview

Enhance the performance of your electronic devices with the VN330SP by STMicroelectronics, a top-tier manufacturer known for quality and reliability. As a leading player in the peripheral drivers category, this product offers built-in protections against over current, thermal issues, and under voltage, ensuring seamless operation and longevity. With a compact design and maximum output current of 0.5A, it provides exceptional value and benefits to customers looking to optimize their systems. Upgrade your applications with the VN330SP and experience unparalleled efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the peripheral driver suitable for a wide range of applications.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, the peripheral driver can handle a variety of power sources, increasing its versatility.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of the peripheral driver, preventing damage from overloads or voltage fluctuations.

No. of Functions: 4

Having multiple functions in a single peripheral driver reduces the need for additional components, simplifying the circuit design and reducing costs.

Output Current Flow Direction: SOURCE

The source output current flow direction simplifies the connection to other components in the circuit, making it easier to integrate the peripheral driver into a system.

Technical Specifications

Peripheral Drivers VN330SP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

4

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

40 us

Width:

7.5 mm

Trade Compliance

VN330SP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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