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VN02NPT13TR

STMicroelectronics

VN02NPT13TR by STMicroelectronics

VN02NPT13TR by STMicroelectronics is a compact peripheral driver with a max supply voltage of 26V and supports output currents up to 3A. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for buffer or inverter applications in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

-

-

-

-

Anansix

USA . 1,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,788

-

-

-

-

Vyrian

USA . 1,414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,414

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,460 parts In-Stock

1+ parts

$9.436

100+ parts

-

1k+ parts

$8.492

10k+ parts

-

1,460

$9.436

-

$8.492

-

MKK Technologies

India . 2,058 parts In-Stock

1+ parts

$17.743

100+ parts

-

1k+ parts

-

10k+ parts

-

2,058

$17.743

-

-

-

DigiPath Technology Company

USA . 2,058 parts In-Stock

1+ parts

$17.743

100+ parts

-

1k+ parts

-

10k+ parts

-

2,058

$17.743

-

-

-

Corphita

USA . 3,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,923

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,478

-

-

-

-

Parana Technologies

USA . 941 parts In-Stock

1+ parts

-

100+ parts

$11.282

1k+ parts

-

10k+ parts

-

941

-

$11.282

-

-

Overview

Elevate your designs with the VN02NPT13TR from STMicroelectronics—a trusted leader in innovation and reliability. This versatile peripheral driver is engineered for excellence, featuring built-in protections against overcurrent, thermal issues, and undervoltage. Perfect for automotive, industrial, and consumer applications, it ensures robust performance while simplifying integration. Experience unmatched quality and customer support that drives value, transforming your projects into success stories.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, making the product suitable for various applications while ensuring reliability.

Surface Mount: YES

Facilitates easy integration into modern electronics with space-saving designs.

Maximum Supply Voltage: 26 V

Provides flexibility in design, allowing compatibility with a wide range of voltage requirements.

Package Shape: RECTANGULAR

Optimizes space utilization on circuit boards for compact device designs.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Enhances safety and reliability by protecting the device from damages during operation.

Power Supplies (V): 13

Standard power supply requirement simplifies design processes for engineers.

No. of Terminals: 4

Allows for straightforward connections, making it easier to implement in a variety of circuits.

Package Style (Meter): SMALL OUTLINE

Facilitates a compact form factor, making it ideal for space-constrained projects.

Minimum Supply Voltage: 7 V

Versatile use in low-power applications without compromising functionality.

Terminal Finish: TIN LEAD

Provides good solderability and ensures robust electrical connections.

Terminal Position: SINGLE

Simplicity in layout and design for easy integration into printed circuit boards.

Maximum Seated Height: 2.63 mm

Low profile design enhances compatibility with slim devices.

Width: 6.1 mm

Compact size offers design flexibility, fitting into diverse applications.

Length: 6.5 mm

Compact dimensions maintain design efficiency and reduce board space usage.

Maximum Output Current: 3 A

Capable of driving substantial loads, making it suitable for high-performance circuits.

Terminal Form: GULL WING

Ensures optimal mechanical and electrical performance for secure connections.

Nominal Supply Voltage: 13 V

Allows for standardized voltage operation, enhancing reliability in performance.

Terminal Pitch: 1.27 mm

Compact terminal spacing allows for denser component placement, maximizing board real estate.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile functionality, enabling it to fit various application needs effectively.

Output Current Flow Direction: SOURCE

Optimizes power distribution in a circuit, enhancing overall system efficiency.

Technical Specifications

Peripheral Drivers VN02NPT13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.37,50TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Width:

6.1 mm

Trade Compliance

VN02NPT13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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