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VN02AN(012Y)

STMicroelectronics

VN02AN(012Y) by STMicroelectronics

STMicroelectronics' VN02AN(012Y) is a BICMOS technology-based peripheral driver with 3A max output current. It operates on 9-36V power supplies, offering built-in protections for overcurrent, thermal, and undervoltage. Ideal for applications requiring source flow direction such as buffer or inverter based interface ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,551 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,551

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Digiode

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,984

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Anansix

USA . 1,614 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,614

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 375 parts In-Stock

1+ parts

$11.329

100+ parts

-

1k+ parts

$10.196

10k+ parts

-

375

$11.329

-

$10.196

-

MKK Technologies

India . 883 parts In-Stock

1+ parts

$21.303

100+ parts

-

1k+ parts

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10k+ parts

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883

$21.303

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DigiPath Technology Company

USA . 883 parts In-Stock

1+ parts

$21.303

100+ parts

-

1k+ parts

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10k+ parts

-

883

$21.303

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-

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Corphita

USA . 3,423 parts In-Stock

1+ parts

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3,423

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Parana Technologies

USA . 339 parts In-Stock

1+ parts

-

100+ parts

$13.545

1k+ parts

-

10k+ parts

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339

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$13.545

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Overview

Unlock the potential of your electronic devices with the VN02AN(012Y) by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers high-quality peripheral drivers that offer reliable performance and durability. Ideal for a wide range of applications, this product provides built-in protections against over current, thermal issues, and under voltage. With a maximum supply voltage of 36V and a maximum output current of 3A, the VN02AN(012Y) is designed to meet your power supply needs efficiently. Experience the value and benefits of this innovative technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body ensures durability and reliability of the peripheral driver, making it suitable for various applications.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage of 36V, this peripheral driver can handle a wide range of power inputs, making it versatile for different setups.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections against over current, thermal issues, and under voltage ensure the safety and longevity of connected devices and the driver itself.

Maximum Output Current: 3 A

The high maximum output current of 3A allows this peripheral driver to power multiple devices or components simultaneously without any issues.

Technology: BICMOS

The BICMOS technology used in this peripheral driver offers a good balance between analog and digital capabilities, providing efficient and reliable performance.

Nominal Supply Voltage: 30 V

The nominal supply voltage of 30V ensures stable and consistent power delivery to connected devices, reducing the risk of voltage fluctuations.

Technical Specifications

Peripheral Drivers VN02AN(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSFM-T5

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3 A

Nominal Output Peak Current Limit:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP5,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

9/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

30 V

Surface Mount:

NO

Technology:

BICMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

VN02AN(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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