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VN02NSP13TR

STMicroelectronics

VN02NSP13TR by STMicroelectronics

VN02NSP13TR from STMicroelectronics is a compact peripheral driver with a max supply voltage of 26V and supports output currents up to 3A. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for buffer or inverter applications, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,577

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-

-

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Vyrian

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

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-

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-

Anansix

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,163

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 196 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$2.500

-

-

-

IDEA Electronic Components Group

UK . 1,598 parts In-Stock

1+ parts

$9.712

100+ parts

-

1k+ parts

$8.740

10k+ parts

-

1,598

$9.712

-

$8.740

-

AZTECH Wire

Italy . 1,140 parts In-Stock

1+ parts

$14.440

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$14.440

-

-

-

Ampacity Inc.

Singapore . 1,534 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,534

$14.500

-

-

-

MKK Technologies

India . 1,516 parts In-Stock

1+ parts

$18.262

100+ parts

-

1k+ parts

-

10k+ parts

-

1,516

$18.262

-

-

-

DigiPath Technology Company

USA . 1,516 parts In-Stock

1+ parts

$18.262

100+ parts

-

1k+ parts

-

10k+ parts

-

1,516

$18.262

-

-

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Component Stockers USA

USA . 547 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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547

$99.990

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Corphita

USA . 4,429 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,429

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Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

-

100+ parts

$11.612

1k+ parts

-

10k+ parts

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2,286

-

$11.612

-

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Overview

Unlock the power of innovation with the VN02NSP13TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile peripheral driver ensures robust performance with built-in protections against overcurrent and thermal issues, making it ideal for automotive and industrial applications. Experience enhanced efficiency and reliability while benefiting from ST's commitment to excellence. Elevate your projects today with this dependable component designed to exceed your expectations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this peripheral driver reliable in various applications.

Surface Mount: YES

Surface mount technology allows for efficient space management on PCBs, enabling compact designs and facilitating automated assembly.

Maximum Supply Voltage: 26 V

A high maximum supply voltage increases versatility, allowing the driver to be used in a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to a stable design layout on the printed circuit board, optimizing space and positioning.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance reliability and safety, preventing damage under adverse conditions and prolonging the product lifespan.

Power Supplies (V): 13

A nominal supply voltage of 13 V makes this driver suitable for common peripheral applications, ensuring compatibility with standard systems.

No. of Terminals: 10

With 10 terminals, this product offers sufficient connectivity options, facilitating easy integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug ensures efficient thermal management in high-performance applications.

Minimum Supply Voltage: 7 V

This minimum supply voltage allows for operation in lower power environments, making it adaptable for battery-powered or energy-sensitive applications.

Terminal Finish: MATTE TIN

The matte tin finish provides enhanced solderability and resistance to oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal position helps in organized layouts and simplifies PCB design by providing flexibility in placement.

Maximum Seated Height: 3.75 mm

A maximum seated height of 3.75 mm keeps the profile low, which is ideal for space-constrained designs.

Width: 7.5 mm

A width of 7.5 mm balances compactness with accessibility, making it suitable for a variety of devices.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand peak reflow temperatures aids in manufacturing robustness, contributing to consistent product quality.

Peak Reflow Temperature °C: 250

A high peak reflow temperature indicates compatibility with modern assembly techniques, ensuring reliable solder joints.

Length: 9.4 mm

The compact length of 9.4 mm allows for efficient use of space on a PCB, which is crucial in today’s miniaturization trends.

Maximum Output Current: 3 A

A maximum output current of 3 A supports robust performance for peripheral devices, ensuring adequate power delivery.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improve mechanical stability, enhancing reliability in various applications.

Nominal Supply Voltage: 13 V

Maintaining a nominal supply voltage of 13 V ensures the driver operates effectively across different load conditions.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a good balance between density and ease of PCB layout, facilitating both automated and manual assembly.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that the product can withstand humidity exposure, making it suitable for a range of operating environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Featuring a buffer or inverter based design ensures flexibility in interfacing, allowing for a wide range of applications.

Output Current Flow Direction: SOURCE

The output current flow direction as source allows for straightforward design integration where power delivery is critical.

Technical Specifications

Peripheral Drivers VN02NSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VN02NSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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