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UPSD3434EVB40U6

STMicroelectronics

UPSD3434EVB40U6 by STMicroelectronics

UPSD3434EVB40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 46 I/O lines, ADC channels, and is ideal for industrial applications due to its wide temperature range (-40 °C to 85 °C). Its compact design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,089 parts In-Stock

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Anansix

USA . 2,317 parts In-Stock

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2,317

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Digiode

USA . 1,130 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 95 parts In-Stock

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$10.980

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95

$10.980

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IDEA Electronic Components Group

UK . 11 parts In-Stock

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$66.250

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-

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$59.625

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11

$66.250

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$59.625

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MKK Technologies

India . 302 parts In-Stock

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$124.579

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302

$124.579

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DigiPath Technology Company

USA . 302 parts In-Stock

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$124.579

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302

$124.579

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QUARKTWIN TECHNOLOGY LTD

USA . 11,101 parts In-Stock

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Kepictronics

USA . 5,990 parts In-Stock

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5,990

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GreenTree Electronics

Israel . 4,485 parts In-Stock

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Microchip USA

USA . 4,115 parts In-Stock

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Corphita

USA . 3,101 parts In-Stock

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Vigor

Singapore . 2,355 parts In-Stock

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Parana Technologies

USA . 968 parts In-Stock

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$79.212

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$79.212

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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Overview

Elevate your projects with the UPSD3434EVB40U6 from STMicroelectronics, a powerhouse microcontroller that delivers unmatched performance and reliability. Crafted with precision, this versatile device is perfect for industrial applications, ensuring robust operation even in extreme conditions. Experience seamless integration and enhanced efficiency in your designs, backed by STMicroelectronics’ renowned quality and innovation. Unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the microcontroller, making it suitable for a variety of environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is energy-efficient, which is vital for battery-operated applications.

Address Bus Width: 16

A 16-bit address bus width enables the microcontroller to access a larger memory space, supporting more complex applications.

Package Shape: SQUARE

The square shape facilitates easier layout design on the PCB, improving the overall efficiency of circuit designs.

Bit Size: 8

An 8-bit architecture is suitable for a wide range of simple control applications, providing adequate processing power for many embedded systems.

Power Supplies (V): 3.3

Designed to operate at 3.3 V, this microcontroller enhances compatibility with low-power devices and modern digital systems.

No. of Terminals: 80

Having 80 terminals offers ample connectivity options for a variety of peripherals and components, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile style aids in space-saving designs, while fine pitch allows for a higher density of connections.

Minimum Supply Voltage: 3 V

Operating at a minimum supply voltage of 3 V ensures stable performance in power-sensitive applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this microcontroller suitable for industrial applications where heat can be a factor.

CPU Family: 8051

The 8051 family is widely used and supported, making it a reliable choice for many developers with a robust ecosystem.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C is essential for applications in extreme environments, ensuring reliability under harsh conditions.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and resistance to corrosion, ensuring long-term reliability and performance.

ADC Channels: YES

The inclusion of ADC channels facilitates integration with analog sensors, broadening the microcontroller's application scope.

Terminal Position: QUAD

Quad-terminal positioning allows for efficient layout and connections, which is critical in compact designs.

ROM Words: 262144

With 262144 ROM words, the microcontroller can store substantial programs and firmware, providing flexibility in software development.

Maximum Seated Height: 1.6 mm

A low maximum seated height supports compact designs in space-constrained applications.

Width: 12 mm

A width of 12 mm contributes to the low profile of the device, allowing for dense circuit board designs.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data processing, which is sufficient for many microcontroller applications.

Maximum Clock Frequency: 40 MHz

A clock frequency of 40 MHz ensures that the microcontroller can handle demanding tasks and operations efficiently.

Length: 12 mm

The compact length of 12 mm allows for densely packed designs without sacrificing performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures durability and reliability for applications in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Being categorized as a microcontroller, it is tailored for control applications, providing a versatile solution for embedded systems.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller efficiently handles data-intensive applications and contributes to overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it ideal for many portable and battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection to PCBs, enhancing manufacturability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with modern digital devices, ensuring compatibility and efficiency.

PWM Channels: YES

The presence of PWM channels enables precise control of motors and other actuators, broadening its application in automation and robotics.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, making it convenient for iterative development and deployment.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density arrangements, making it suitable for sophisticated circuitry.

Speed: 40 rpm

A 40 rpm speed rating indicates suitability for applications requiring specific rotational control, such as servo motors.

No. of I/O Lines: 46

With 46 I/O lines, a wide range of interfacing options are available, increasing the versatility for various applications.

Technical Specifications

Microcontrollers UPSD3434EVB40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3434EVB40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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