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UPSD3433EVB40U6

STMicroelectronics

UPSD3433EVB40U6 by STMicroelectronics

UPSD3433EVB40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 131072 ROM words and 8192 RAM bytes, making it ideal for industrial applications requiring robust performance. Its compact design includes a low-profile flatpack package suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,729 parts In-Stock

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5,729

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Chip Stock

USA . 3,706 parts In-Stock

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3,706

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Digiode

USA . 3,162 parts In-Stock

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3,162

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Anansix

USA . 1,864 parts In-Stock

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1,864

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Distributors (Availability)

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AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$21.020

100+ parts

-

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757

$21.020

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Microchip USA

USA . 257 parts In-Stock

1+ parts

$22.646

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257

$22.646

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IDEA Electronic Components Group

UK . 1,788 parts In-Stock

1+ parts

$57.650

100+ parts

-

1k+ parts

$51.885

10k+ parts

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1,788

$57.650

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$51.885

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MKK Technologies

India . 436 parts In-Stock

1+ parts

$108.407

100+ parts

-

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436

$108.407

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DigiPath Technology Company

USA . 436 parts In-Stock

1+ parts

$108.407

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436

$108.407

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Corphita

USA . 3,419 parts In-Stock

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3,419

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Vigor

Singapore . 2,733 parts In-Stock

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2,733

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Parana Technologies

USA . 1,886 parts In-Stock

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$68.929

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1,886

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$68.929

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Overview

Unlock the potential of your projects with the UPSD3433EVB40U6 microcontroller from STMicroelectronics! Renowned for their superior quality and innovation, STMicroelectronics delivers a versatile solution that enhances performance in industrial applications. With its compact design, efficient power management, and robust features, this microcontroller ensures seamless integration and reliability, giving you the edge in developing advanced electronics. Experience the difference with STMicroelectronics—where excellence meets ingenuity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, protecting the microcontroller from environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances power efficiency, making it ideal for low-power applications.

Address Bus Width: 16

A 16-bit address bus width allows for a larger memory addressing capability, enabling complex applications.

Package Shape: SQUARE

The square package shape provides a uniform footprint, which simplifies layout on PCBs.

Bit Size: 8

The 8-bit size offers simplicity and ease of programming for many embedded applications.

Power Supplies (V): 3.3

Operating at 3.3V minimizes power consumption and heat generation, ideal for battery-powered devices.

No. of Terminals: 80

With 80 terminals, it allows for ample input/output connections, supporting extensive peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design aids in high-density circuit designs and improves thermal performance.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures compatibility with various low-power systems and extends battery life.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C guarantees reliable performance in demanding environments.

CPU Family: 8051

Based on the well-known 8051 architecture, it benefits from a large existing ecosystem and community support.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C makes this microcontroller suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finishing enhances solderability and reduces oxidation, improving reliability over time.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making it versatile for various sensor applications.

Terminal Position: QUAD

Quad terminal positioning improves PCB layout flexibility and density, enhancing design efficiency.

ROM Words: 131072

A substantial ROM capacity enables storage of extensive program code, facilitating complex control tasks.

Maximum Seated Height: 1.6 mm

A low seated height allows for better airflow and thermal management within tightly packed designs.

Width: 12 mm

Its compact width ensures compatibility in small form factor designs while maximizing I/O functionality.

External Data Bus Width: 8

An 8-bit external data bus width streamlines communication with external devices, enhancing integration capabilities.

Maximum Clock Frequency: 40 MHz

With a clock frequency of 40 MHz, it delivers sufficient processing power for demanding applications.

Length: 12 mm

The compact length allows easy integration into various circuit designs, particularly for space-constrained projects.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges signifies reliability in harsh operational environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing capabilities with peripheral control, ideal for embedded system design.

RAM Bytes: 8192

With 8192 bytes of RAM, it supports moderate complexity in data handling and program execution.

Technology: CMOS

CMOS technology enhances power efficiency and minimizes heat generation, leading to longer product lifespan.

Terminal Form: GULL WING

The gull wing terminal form factor facilitates easier and more effective soldering during assembly.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V supports modern low-voltage logic levels, ensuring compatibility with contemporary circuits.

PWM Channels: YES

Having PWM channels allows for advanced control over motors and other actuators, enhancing functionality.

ROM Programmability: FLASH

Flash programmability provides the ability to update firmware easily and efficiently, extending the product's lifecycle.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density connections, saving space in compact electronic designs.

Speed: 40 rpm

A speed rating of 40 rpm suggests specific application capabilities, making it suitable for particular control tasks.

No. of I/O Lines: 46

Having 46 I/O lines allows extensive interfacing options, supporting diverse application requirements.

Technical Specifications

Microcontrollers UPSD3433EVB40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3433EVB40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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