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UPSD3234A-40U6T

STMicroelectronics

UPSD3234A-40U6T by STMicroelectronics

UPSD3234A-40U6T by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V, featuring 262144 ROM words and 4096 RAM words. It supports I2C, UART, and USB connectivity for versatile applications. Ideal for industrial use, it operates in temperatures from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,490 parts In-Stock

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6,490

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Digiode

USA . 2,761 parts In-Stock

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2,761

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Anansix

USA . 925 parts In-Stock

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925

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Distributors (Availability)

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AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$19.880

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803

$19.880

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Microchip USA

USA . 415 parts In-Stock

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$24.199

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415

$24.199

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IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$74.982

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$67.484

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2,121

$74.982

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$67.484

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Component Stockers USA

USA . 298 parts In-Stock

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$99.990

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298

$99.990

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MKK Technologies

India . 1,911 parts In-Stock

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$140.998

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1,911

$140.998

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$140.998

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1,911

$140.998

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QUARKTWIN TECHNOLOGY LTD

USA . 15,795 parts In-Stock

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15,795

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,989 parts In-Stock

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1,989

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

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$89.652

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1,544

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$89.652

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Overview

Unlock your project's potential with the UPSD3234A-40U6T from STMicroelectronics, a leader in innovation and reliability. This cutting-edge microcontroller blends versatility and efficiency, making it ideal for industrial applications where performance is critical. Experience superior control with advanced features, low power consumption, and robust connectivity options, all crafted to enhance your designs and drive success. Elevate your solutions with ST’s trusted quality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection against environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring safe operation.

Address Bus Width: 12

With a 12-bit address bus, the microcontroller supports a substantial memory range, allowing for more complex applications.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation and effective layout on PCBs.

Bit Size: 8

Being an 8-bit microcontroller makes it suitable for straightforward control tasks, making it ideal for simpler embedded systems.

No. of Terminals: 80

The high number of terminals offers ample interfacing options for various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for applications requiring slim designs without sacrificing performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for compatibility with a broad range of power sources.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures functionality in industrial settings with varying thermal conditions.

CPU Family: 8051

Based on the well-established 8051 CPU family, the microcontroller benefits from a wealth of resources and community support.

No. of External Interrupts: 2

Two external interrupts provide responsive designs for real-time applications, enhancing control and monitoring capabilities.

Minimum Operating Temperature: -40 °C

The extreme temperature range (-40 °C) makes this microcontroller suitable for harsh industrial environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides better solderability and reduces oxidation risks, improving assembly reliability.

ADC Channels: YES

Integration of ADC channels allows for precise analog inputs, which is essential for sensor interfacing.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and supports more reliable solder connections.

ROM Words: 262144

The large ROM capacity allows for ample program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm aids in low-profile design while maintaining performance.

RAM Words: 4096

With 4096 words of RAM, it provides sufficient data handling capabilities for moderate applications.

Width: 12 mm

A compact width of 12 mm enables easy integration into tight spaces, suitable for various applications.

Boundary Scan: YES

The boundary scan capability facilitates easier testing and debugging, improving development efficiency.

External Data Bus Width: 8

An 8-bit external data bus is sufficient for many control applications, keeping the design straightforward.

Peripherals: POR; PWM(5); TIMER(3); WDT

Included peripherals such as PWM, timers, and watchdog timer enhance control and monitoring functions.

Length: 12 mm

Small length supports efficient use of space in embedded systems, making it a versatile choice.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is built specifically for controlling other peripherals and simplifying design.

Technology: CMOS

CMOS technology offers low power consumption, making the microcontroller ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling during manufacturing and ensure stable mechanical connections.

Analog To Digital Converters: 4-Ch 8-Bit

Four 8-bit ADC channels provide multi-channel input capabilities, enhancing versatility in sensor applications.

Maximum Supply Current: 62 mA

The peak supply current of 62 mA allows the microcontroller to drive multiple peripherals without performance degradation.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with common microcontroller power supplies.

PWM Channels: YES

The inclusion of PWM channels is beneficial for applications requiring motor control or signal modulation.

Connectivity: I2C; UART(2); USB

Multiple connectivity options enable smooth interfacing with a variety of devices, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, extending product lifecycle.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch is ideal for compact designs and high-density PCB layouts.

Format: FIXED POINT

Fixed-point format processing provides efficient arithmetic operations, beneficial for control algorithms.

Speed: 40 rpm

A speed specification of 40 rpm is advantageous for control applications requiring consistent performance.

Low Power Mode: YES

Low power mode capability is perfect for energy-efficient applications, extending battery life in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports simplified programming and control flow for embedded applications.

No. of I/O Lines: 46

With 46 I/O lines, extensive interfacing options are available, facilitating connection with various external devices.

Technical Specifications

Microcontrollers UPSD3234A-40U6T attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Address Bus Width:

12

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

2

No. of I/O Lines:

46

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2); USB

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3234A-40U6T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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