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UPSD3212CV-24U6

STMicroelectronics

UPSD3212CV-24U6 by STMicroelectronics

UPSD3212CV-24U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 24 MHz. It features 46 I/O lines, 2048 bytes of RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 8,360 parts In-Stock

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Anansix

USA . 2,556 parts In-Stock

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Digiode

USA . 2,006 parts In-Stock

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2,006

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Semi Source

USA . 636 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 112 parts In-Stock

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Connector Distribution Corp

USA . 32 parts In-Stock

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Right Parts Inc.

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LWI Electronics Inc

India . 10 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Microchip USA

USA . 157 parts In-Stock

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$8.568

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AZTECH Wire

Italy . 178 parts In-Stock

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$11.010

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IDEA Electronic Components Group

UK . 858 parts In-Stock

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$23.095

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$20.785

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MKK Technologies

India . 952 parts In-Stock

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$43.428

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DigiPath Technology Company

USA . 952 parts In-Stock

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$43.428

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$43.428

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A-Z Elektronik GmbH

Germany . 5,300 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,620 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Vigor

Singapore . 1,160 parts In-Stock

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Parana Technologies

USA . 1,113 parts In-Stock

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$27.613

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Overview

Elevate your projects with the UPSD3212CV-24U6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for excellence, this reliable device excels in demanding industrial applications, offering unmatched performance in compact form. With its robust features and superior energy efficiency, you can power advanced designs while ensuring longevity and stability. Unlock endless possibilities and drive your innovations forward with ST's trusted quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that ensures long-term reliability in various applications.

Surface Mount: YES

Allows for compact designs and easy integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, ensuring compatibility with various systems.

Address Bus Width: 12

Allows access to a larger memory space, enhancing the microcontroller's capability in handling complex tasks.

Package Shape: SQUARE

Optimizes space utilization on PCBs, making it suitable for compact electronic designs.

Bit Size: 8

Ideal for simple applications requiring efficient data processing, perfect for embedded systems.

Power Supplies (V): 3.3

Supports low-power consumption applications, contributing to energy efficiency.

No. of Terminals: 80

Provides ample connectivity options for various peripherals, enhancing system expandability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ensures a compact footprint that is essential for sophisticated, space-constrained designs.

Minimum Supply Voltage: 3 V

Offers greater flexibility in power supply selection, which can reduce costs and enhance compatibility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where components must withstand high temperatures.

CPU Family: 8051

Well-known architecture with a broad range of development tools and community support, making it easier to implement.

Minimum Operating Temperature: -40 °C

Allows operation in extreme conditions, making it an ideal choice for outdoor and harsh environment applications.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and improves solderability, ensuring high reliability in connections.

ADC Channels: YES

Enables direct interfacing with analog sensors, enhancing the microcontroller's versatility for various applications.

Terminal Position: QUAD

Facilitates better layout design on PCBs, making routing and component placement easier.

ROM Words: 65536

Sufficient memory capacity for a range of applications, allowing for complex program development.

Maximum Seated Height: 1.6 mm

Low profile design enhances compatibility with compact PCB designs and enclosures.

Width: 12 mm

Standard size that fits well within various PCB layouts, facilitating easier integration.

External Data Bus Width: 8

Provides optimal data transfer rates for applications that do not require extensive data width.

Maximum Clock Frequency: 24 MHz

Offers sufficient processing power for a wide variety of applications without excessive power consumption.

Length: 12 mm

Compact size suitable for space-constrained projects, keeping overall product dimensions smaller.

Temperature Grade: INDUSTRIAL

Designed for use in industrial applications where reliability and performance in a range of temperatures are critical.

Peripheral IC Type: MICROCONTROLLER

Combines processing power with control functions, making it a versatile choice for embedded applications.

RAM Bytes: 2048

Provides enough RAM for running moderately complex applications, enhancing performance.

Technology: CMOS

Enables low power consumption and high speed, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Offers easier soldering and better mechanical strength, ensuring robust connections on PCBs.

Maximum Supply Current: 20 mA

Maintains lower power consumption, suitable for battery-sensitive applications.

Nominal Supply Voltage: 3.3 V

Common operating voltage, ensuring compatibility with a wide range of components and systems.

PWM Channels: YES

Supports PWM control for applications requiring motor control or signal modulation.

ROM Programmability: FLASH

Enables easy updating and programming of the firmware, enhancing the microcontroller's adaptability.

Terminal Pitch: 0.5 mm

Facilitates high-density mounting on PCBs, crucial for compact electronic designs.

Speed: 24 rpm

Optimal for applications requiring moderate speed performance, balancing efficiency and effectiveness.

No. of I/O Lines: 46

Provides robust options for connections to various sensors and devices, allowing flexibility in design.

Technical Specifications

Microcontrollers UPSD3212CV-24U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3212CV-24U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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