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TYN210

STMicroelectronics

TYN210 by STMicroelectronics

TYN210 by STMicroelectronics is a single SCR in a rectangular plastic package, ideal for power control applications. It features a max DC gate trigger current of 15 mA, non-repetitive peak on-state current of 100 A, and operates b/w -40 °C to 125°C. This device is perfect for managing high voltage and current loads efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,838 parts In-Stock

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Anansix

USA . 2,474 parts In-Stock

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2,474

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Digiode

USA . 901 parts In-Stock

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901

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ECAB

Sweden . 114 parts In-Stock

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MISTER SPROCKETS

USA . 95 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 339 parts In-Stock

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$3.858

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$3.473

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339

$3.858

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$3.473

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MKK Technologies

India . 142 parts In-Stock

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$7.256

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$7.256

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DigiPath Technology Company

USA . 142 parts In-Stock

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$7.256

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Corphita

USA . 2,058 parts In-Stock

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Parana Technologies

USA . 1,210 parts In-Stock

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$4.613

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Overview

Unlock the power of reliable performance with the TYN210 from STMicroelectronics, a leader in innovative semiconductor solutions. This premium Silicon Controlled Rectifier (SCR) guarantees exceptional efficiency and durability across diverse applications, from industrial automation to consumer electronics. Its robust design ensures minimal leakage and superior current handling, delivering peace of mind for your projects. Experience unmatched quality and support with STMicroelectronics – where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and resistance to environmental factors, making this SCR suitable for various applications.

Maximum DC Gate Trigger Current: 15 mA

A relatively low gate trigger current enhances ease of drive and reduces power consumption during operation.

Configuration: SINGLE

Single configuration simplifies circuit design, providing a straightforward implementation in electronic systems.

Non Repetitive Peak On-state Current: 100 A

The capability to handle high peak currents makes this SCR robust for applications involving high-power regulation.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on circuit boards, allowing for better layout and integration.

Terminal Form: THROUGH-HOLE

Through-hole design enhances mechanical stability and reliability in high-stress environments.

Maximum On-state Current: 10 A

A maximum on-state current of 10 A ensures effective conduction in medium-power applications.

Maximum Leakage Current: 2 mA

Low leakage current minimizes power loss, improving efficiency in applications where energy conservation is critical.

Repetitive Peak Reverse Voltage: 200 V

With a high reverse voltage rating, this SCR can handle voltages in challenging environments, ensuring reliability.

Maximum Repetitive Peak Off-state Leakage Current: 10 µA

The very low off-state leakage current contributes to low power dissipation, enhancing overall circuit efficiency.

No. of Terminals: 3

Three-terminal configuration allows flexibility in circuit design and simplifies integration with existing systems.

Package Style (Meter): FLANGE MOUNT

Flange mount provides robust physical support, allowing for better heat dissipation and mechanical stability.

Maximum Operating Temperature: 125 °C

A high operational temperature range makes this SCR suitable for use in harsh environments.

Trigger Device Type: SCR

SCR technology allows for high efficiency and reliability in switching applications, making it a preferred choice for control systems.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in both extreme heat and cold, suitable for diverse applications.

Terminal Finish: MATTE TIN

Matte tin provides excellent solderability and corrosion resistance, ensuring durable connections in various environments.

Terminal Position: SINGLE

Single terminal position simplifies layout and integration into circuit boards.

Maximum RMS On-state Current: 10 A

The maximum RMS on-state current rating ensures reliable operation in continuous load applications.

Maximum DC Gate Trigger Voltage: 1.5 V

A low gate trigger voltage promotes efficient operation while minimizing the energy required for activation.

Repetitive Peak Off-state Voltage: 200 V

High off-state voltage rating enhances the device's ability to withstand voltage spikes without failure.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/µs

High critical rate allows for rapid voltage transitions, essential for high-frequency applications.

Maximum Holding Current: 30 mA

The maximum holding current enables efficient device operation with minimal energy wastage during holding conditions.

Nominal Circuit Commutated Turn-off Time: 70 µs

Fast turn-off time increases the responsiveness of the SCR in dynamic circuits, making it ideal for rapid switching applications.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TYN210 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Nominal Circuit Commutated Turn-off Time:

70 us

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

15 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

30 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

Non Repetitive Peak On-state Current:

100 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

10 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

10 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

200 V

Repetitive Peak Reverse Voltage:

200 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

TYN210 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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