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T2510N06TOFVTXPSA1

Infineon Technologies

T2510N06TOFVTXPSA1 by Infineon Technologies

Infineon's T2510N06TOFVTXPSA1 SCR has 600V repetitive peak reverse voltage, 5350A max RMS on-state current, and 250mA DC gate trigger current. Ideal for high-power applications requiring reliable switching in a single configuration with surface mount capability.

Median Price

$417.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$417.950

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150

$417.950

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Vyrian

USA . 6,011 parts In-Stock

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-

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6,011

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Digiode

USA . 589 parts In-Stock

1+ parts

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589

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,251 parts In-Stock

1+ parts

$3.384

100+ parts

$3.249

1k+ parts

$3.113

10k+ parts

-

3,251

$3.384

$3.249

$3.113

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$3.764

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152

$3.764

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Aztec Data Supply Inc.

USA . 4,819 parts In-Stock

1+ parts

$4.130

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4,819

$4.130

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AZTECH Wire

Italy . 309 parts In-Stock

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$7.051

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309

$7.051

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Semicontronic

India . 1,533 parts In-Stock

1+ parts

$10.100

100+ parts

$9.848

1k+ parts

$9.797

10k+ parts

-

1,533

$10.100

$9.848

$9.797

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Ampacity Inc.

Singapore . 449 parts In-Stock

1+ parts

$20.100

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449

$20.100

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Continental Prestige Electronics

USA . 6,514 parts In-Stock

1+ parts

$417.950

100+ parts

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$409.591

6,514

$417.950

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$409.591

Argo Parts USA

USA . 2,498 parts In-Stock

1+ parts

$417.950

100+ parts

$413.771

1k+ parts

$409.591

10k+ parts

$405.412

2,498

$417.950

$413.771

$409.591

$405.412

Advanced Electronics

New Zealand . 73 parts In-Stock

1+ parts

$426.309

100+ parts

$426.309

1k+ parts

$426.309

10k+ parts

-

73

$426.309

$426.309

$426.309

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Microchip USA

USA . 5,390 parts In-Stock

1+ parts

$627.008

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5,390

$627.008

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Corphita

USA . 137 parts In-Stock

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137

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Overview

Unlock the power of advanced technology with the T2510N06TOFVTXPSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon brings you top-notch quality and reliability in their Silicon Controlled Rectifiers (SCR). This product offers unparalleled performance and efficiency, making it perfect for a wide range of applications. From industrial machinery to power supply units, the T2510N06TOFVTXPSA1 delivers exceptional value and benefits to customers looking for high-quality components they can trust. Choose Infineon for superior technology that exceeds expectations.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 250 mA

Allows for precise control of the SCR, making it suitable for a wide range of applications.

Configuration: SINGLE

SINGLE configuration simplifies the setup and usage of the SCR.

Surface Mount: YES

Ease of installation and space-saving design.

Package Shape: ROUND

Round shape is ideal for certain mounting configurations and applications.

Repetitive Peak Reverse Voltage: 600 V

Provides high reverse voltage protection, making it durable and reliable.

No. of Terminals: 4

Offers flexibility in connection options.

Package Style (Meter): DISK BUTTON

Disk button package style allows for easy handling and installation.

Maximum Operating Temperature: 140 °C

Can withstand high temperatures, suitable for various environments.

Trigger Device Type: SCR

SCR technology ensures reliable and precise switching capabilities.

Minimum Operating Temperature: -40 °C

Can operate efficiently in cold environments as well.

Maximum RMS On-state Current: 5350 A

High on-state current capability, suitable for high-power applications.

Repetitive Peak Off-state Voltage: 600 V

Ideal for applications requiring high off-state voltage protection.

Reference Standard: IEC-60747-6

Compliance with international standards ensures quality and performance.

Technical Specifications

Silicon Controlled Rectifiers (SCR) T2510N06TOFVTXPSA1 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Configuration:

Maximum DC Gate Trigger Current:

250 mA

JESD-30 Code:

O-XXDB-X4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

5350 A

Reference Standard:

IEC-60747-6

Repetitive Peak Off-state Voltage:

600 V

Repetitive Peak Reverse Voltage:

600 V

Surface Mount:

YES

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

T2510N06TOFVTXPSA1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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