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TSH70CDT

STMicroelectronics

TSH70CDT by STMicroelectronics

TSH70CDT by STMicroelectronics is a compact operational amplifier in an 8-terminal SO package, ideal for precision applications. It features a peak reflow temp of 260 °C and a max seated height of just 1.75 mm. Perfect for space-constrained designs requiring high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,200

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-

-

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Digiode

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,331

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Anansix

USA . 601 parts In-Stock

1+ parts

-

100+ parts

-

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601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,913 parts In-Stock

1+ parts

$5.515

100+ parts

-

1k+ parts

$4.964

10k+ parts

-

1,913

$5.515

-

$4.964

-

MKK Technologies

India . 2,022 parts In-Stock

1+ parts

$10.371

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

$10.371

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-

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DigiPath Technology Company

USA . 2,022 parts In-Stock

1+ parts

$10.371

100+ parts

-

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-

10k+ parts

-

2,022

$10.371

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-

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AZTECH Wire

Italy . 109 parts In-Stock

1+ parts

$13.990

100+ parts

-

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-

109

$13.990

-

-

-

Microchip USA

USA . 252 parts In-Stock

1+ parts

$24.932

100+ parts

-

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10k+ parts

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252

$24.932

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-

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A-Z Elektronik GmbH

Germany . 5,426 parts In-Stock

1+ parts

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5,426

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Vigor

Singapore . 1,493 parts In-Stock

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1,493

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Kepictronics

USA . 1,429 parts In-Stock

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-

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1,429

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Corphita

USA . 745 parts In-Stock

1+ parts

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745

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Parana Technologies

USA . 74 parts In-Stock

1+ parts

-

100+ parts

$6.594

1k+ parts

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10k+ parts

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74

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$6.594

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Overview

Elevate your designs with the TSH70CDT from STMicroelectronics, a premier operational amplifier that delivers unparalleled performance and reliability. Engineered for precision, this compact gem is perfect for diverse applications, from consumer electronics to automation systems. With ST’s commitment to quality and innovation, you gain not just a component, but a trusted partner in enhancing audio clarity, signal integrity, and overall system efficiency. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology enables efficient use of PCB space, allowing for more compact designs and easier automation in manufacturing.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement on PCB layouts, optimizing space and improving design efficiency.

No. of Terminals: 8

With 8 terminals, this op amp allows for versatile connections and functionality while keeping the design manageable.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced physical footprint, essential for modern, space-constrained electronic applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures reliable connections and minimizes oxidation, leading to improved longevity and performance.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on PCBs, accommodating various circuit configurations and designs.

Maximum Seated Height: 1.75 mm

The low maximum seated height is ideal for compact designs, allowing for a slim profile in tightly packed electronic assemblies.

Width: 3.9 mm

A width of 3.9 mm supports space-efficient designs, crucial for modern compact electronics that require high-density packaging.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures reliability during soldering processes, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260 °C, this op amp is compatible with high-temperature soldering processes, enhancing manufacturing flexibility.

Length: 4.9 mm

At a length of 4.9 mm, this op amp is well-suited for compact electronic designs, enabling high-density PCB layouts.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, making it suitable for a wide range of applications in non-critical environments.

Terminal Form: GULL WING

Gull wing terminals provide stability and reliable solder joints, ensuring strong connections that contribute to the durability of the assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this device is versatile and can be used for a variety of applications, such as signal conditioning, filtering, and amplification.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easy handling and assembly, allowing for better compatibility with various PCB designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSH70CDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH70CDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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