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TSH74CPT

STMicroelectronics

TSH74CPT by STMicroelectronics

TSH74CPT by STMicroelectronics is a 14-terminal operational amplifier (Op Amp) with 4 functions, suitable for surface mount applications. With a small outline and thin profile, it has a max seated height of 1.2mm and operates at peak reflow temperature of 260 °C. Ideal for commercial-grade projects requiring precise amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,362 parts In-Stock

1+ parts

-

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4,362

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Digiode

USA . 3,675 parts In-Stock

1+ parts

-

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3,675

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-

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Anansix

USA . 336 parts In-Stock

1+ parts

-

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336

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 132 parts In-Stock

1+ parts

$3.792

100+ parts

-

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-

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-

132

$3.792

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-

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IDEA Electronic Components Group

UK . 2,019 parts In-Stock

1+ parts

$3.911

100+ parts

-

1k+ parts

$3.520

10k+ parts

-

2,019

$3.911

-

$3.520

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MKK Technologies

India . 1,580 parts In-Stock

1+ parts

$7.354

100+ parts

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1,580

$7.354

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DigiPath Technology Company

USA . 1,580 parts In-Stock

1+ parts

$7.354

100+ parts

-

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1,580

$7.354

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-

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AZTECH Wire

Italy . 1,203 parts In-Stock

1+ parts

$9.630

100+ parts

-

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1,203

$9.630

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Component Stockers USA

USA . 717 parts In-Stock

1+ parts

$99.990

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717

$99.990

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Kepictronics

USA . 7,890 parts In-Stock

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7,890

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A-Z Elektronik GmbH

Germany . 5,496 parts In-Stock

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5,496

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Perfect Parts

USA . 1,752 parts In-Stock

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1,752

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Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

-

100+ parts

$4.676

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1,652

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$4.676

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Corphita

USA . 1,622 parts In-Stock

1+ parts

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1,622

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Vigor

Singapore . 1,547 parts In-Stock

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1,547

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Overview

Unleash the power of precision with the TSH74CPT operational amplifier by STMicroelectronics. Crafted with excellence, this versatile component offers unmatched performance in various applications, ensuring reliability and accuracy every time. Ideal for a wide range of functions, this compact and sleek device boasts four functions in one, making it a valuable asset for your projects. Experience the exceptional quality and innovation that STMicroelectronics is renowned for, and elevate your designs with the TSH74CPT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and reliability, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one component simplifies circuit design and reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape of the package offers efficient use of space on the circuit board, fitting well within tight layouts.

No. of Terminals: 14

Having a higher number of terminals allows for more connectivity options, enabling versatile use in various circuit configurations.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, ensuring reliable connections for optimal performance.

Maximum Seated Height: 1.2 mm

Low seated height enables the component to be used in space-constrained environments without compromising on performance.

Width: 4.4 mm

Compact width facilitates easy integration into circuit designs without occupying excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time minimizes the potential for damage to the component during the soldering process, ensuring reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the component suitable for reflow soldering processes commonly used in manufacturing.

Length: 5 mm

The compact length of the component further contributes to space-saving benefits in circuit board layouts.

Temperature Grade: COMMERCIAL

Designed for use in commercial applications, ensuring compatibility with standard operating environments.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical strength and ease of soldering, enhancing the reliability and durability of the connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and commonly used in various circuit designs, offering high performance in amplification and signal processing.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density mounting on circuit boards, maximizing functionality in limited spaces.

Technical Specifications

Operational Amplifiers (Op Amps) TSH74CPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TSH74CPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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