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TSH70CD

STMicroelectronics

TSH70CD by STMicroelectronics

TSH70CD by STMicroelectronics is a compact operational amplifier in an 8-terminal SO package, ideal for precision signal processing. It features a peak reflow temp of 260 °C and a max seated height of just 1.75 mm, making it suitable for space-constrained applications. Its nickel-palladium-gold terminals ensure reliable performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,798 parts In-Stock

1+ parts

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4,798

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Digiode

USA . 2,040 parts In-Stock

1+ parts

-

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2,040

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Anansix

USA . 1,733 parts In-Stock

1+ parts

-

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1,733

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LWI Electronics Inc

India . 59 parts In-Stock

1+ parts

-

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$1.550

100+ parts

-

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-

10k+ parts

-

2,500

$1.550

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-

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$4.894

100+ parts

-

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208

$4.894

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IDEA Electronic Components Group

UK . 854 parts In-Stock

1+ parts

$5.758

100+ parts

-

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$5.182

10k+ parts

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854

$5.758

-

$5.182

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Ampacity Inc.

Singapore . 1,061 parts In-Stock

1+ parts

$8.410

100+ parts

-

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1,061

$8.410

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-

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MKK Technologies

India . 427 parts In-Stock

1+ parts

$10.828

100+ parts

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427

$10.828

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DigiPath Technology Company

USA . 427 parts In-Stock

1+ parts

$10.828

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-

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427

$10.828

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AZTECH Wire

Italy . 427 parts In-Stock

1+ parts

$20.580

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427

$20.580

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Parana Technologies

USA . 1,244 parts In-Stock

1+ parts

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$6.885

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1,244

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$6.885

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Perfect Parts

USA . 907 parts In-Stock

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907

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Corphita

USA . 874 parts In-Stock

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874

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Kepictronics

USA . 230 parts In-Stock

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230

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Overview

Unlock unparalleled performance with the TSH70CD operational amplifier from STMicroelectronics! Renowned for their innovation and reliability, STMicroelectronics delivers a high-quality solution perfect for various applications in audio processing, signal conditioning, and sensor interfacing. With its compact design and robust features, the TSH70CD ensures seamless integration into your projects, elevating efficiency and precision while providing exceptional value for engineers and designers alike. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protects the internal components, making the operational amplifier reliable for various applications.

Surface Mount: YES

Surface-mount technology allows for efficient use of board space and makes assembly easier, enhancing the versatility of the product.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and easy to integrate into various circuit designs without compromising performance.

No. of Terminals: 8

An 8-terminal configuration enables various signal routing options, making the operational amplifier adaptable for different circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint on circuit boards while allowing for high-density layouts, ideal for modern electronics.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances conductivity and resistance to corrosion, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and connection, allowing for straightforward integration into a variety of designs.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures compatibility with compact designs, accommodating a range of applications in tight spaces.

Width: 3.9 mm

A narrow width helps in achieving a compact design, making this operational amplifier suitable for miniaturized projects.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time of 40 seconds is manageable for standard soldering processes, ensuring quality assembly while preventing thermal damage.

Peak Reflow Temperature °C: 260

A peak temperature of 260 °C supports compatibility with lead-free soldering processes, making it compliant with modern manufacturing standards.

Length: 4.9 mm

This compact length contributes to space efficiency on PCBs, facilitating high-density layouts for advanced electronic applications.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this grade ensures reliable performance in standard operating conditions, suitable for a wide range of uses.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability and mechanical stability, enhancing manufacturing yield and longevity of connection.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it provides versatile signal processing capabilities, making it ideal for numerous analog applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of handling during PCB assembly, improving overall manufacturability.

Technical Specifications

Operational Amplifiers (Op Amps) TSH70CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH70CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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