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TSH74CD

STMicroelectronics

TSH74CD by STMicroelectronics

TSH74CD by STMicroelectronics is a 14-terminal operational amplifier (Op Amp) with 4 functions, suitable for surface mount applications. With a package size of 8.65mm x 3.9mm x 1.75mm, it can withstand peak reflow temperatures up to 260 °C making it ideal for commercial-grade temperature-sensitive electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,262 parts In-Stock

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4,262

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Digiode

USA . 3,759 parts In-Stock

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3,759

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Anansix

USA . 1,113 parts In-Stock

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1,113

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Component Sense

UK . 250 parts In-Stock

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250

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ComSIT USA

USA . 200 parts In-Stock

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200

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Zilex Electronics Inc.

Canada . 10 parts In-Stock

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10

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Distributors (Availability)

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Microchip USA

USA . 358 parts In-Stock

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$3.981

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358

$3.981

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IDEA Electronic Components Group

UK . 2,007 parts In-Stock

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$5.870

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$5.283

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2,007

$5.870

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$5.283

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MKK Technologies

India . 436 parts In-Stock

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$11.037

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436

$11.037

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DigiPath Technology Company

USA . 436 parts In-Stock

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$11.037

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436

$11.037

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AZTECH Wire

Italy . 309 parts In-Stock

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$19.980

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309

$19.980

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Kepictronics

USA . 9,320 parts In-Stock

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Vigor

Singapore . 6,905 parts In-Stock

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Parana Technologies

USA . 1,358 parts In-Stock

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$7.018

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$7.018

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Assy Fe

Spain . 1,061 parts In-Stock

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Corphita

USA . 822 parts In-Stock

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822

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Perfect Parts

USA . 101 parts In-Stock

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Overview

Unleash the power of precision with the STMicroelectronics TSH74CD operational amplifier. Crafted by a renowned manufacturer, this high-quality component offers unmatched performance in a compact package. Whether you're designing audio equipment, sensor interfaces, or control systems, the TSH74CD delivers exceptional accuracy and efficiency. Experience the benefits of reliable operation, versatile functionality, and seamless integration, all at an unbeatable value. Upgrade your projects with the TSH74CD and elevate your results to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and helps protect the internal components of the operational amplifier, making it suitable for various environmental conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the operational amplifier on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

With 4 functions integrated into one component, this operational amplifier offers versatility and flexibility in design applications, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape of the operational amplifier enhances compatibility with standard circuit board layouts and allows for efficient space utilization.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for interfacing with other components and external circuits, enhancing the operational capabilities of the amplifier.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures reliable and low-resistance connections, optimizing signal transmission and minimizing signal loss.

Terminal Position: DUAL

The dual terminal position allows for convenient and secure mounting on the circuit board, ensuring stable operation and minimizing the risk of disconnection.

Maximum Seated Height: 1.75 mm

The low maximum seated height makes this operational amplifier suitable for compact and space-constrained designs, offering flexibility in product integration.

Width: 3.9 mm

The compact width of 3.9 mm enables easy placement of the operational amplifier in tight spaces, optimizing board layout and enhancing overall system efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures quick and efficient soldering during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this operational amplifier can withstand high-temperature soldering processes, ensuring reliable and robust solder joints.

Length: 8.65 mm

The moderate length of 8.65 mm provides a balance between compactness and functionality, making it suitable for a wide range of applications without compromising performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade certification indicates that this operational amplifier is designed to meet standard operating temperature requirements, ensuring reliable performance in commercial applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure mechanical attachment and efficient heat dissipation, enhancing the overall reliability and longevity of the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is specifically designed for high-performance signal processing and amplification applications, offering accurate and stable operation.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm allows for easy compatibility with standard PCB layouts, simplifying the design and assembly process.

Technical Specifications

Operational Amplifiers (Op Amps) TSH74CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH74CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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