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TSH73CD

STMicroelectronics

TSH73CD by STMicroelectronics

TSH73CD by STMicroelectronics is a 14-terminal operational amplifier (Op Amp) with 3 functions, suitable for surface mount applications. With a small outline package style and dimensions of 8.65mm x 3.9mm x 1.75mm, it operates at peak reflow temperature of 260 °C for up to 40 seconds, making it ideal for commercial-grade electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 4,594 parts In-Stock

1+ parts

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4,594

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Digiode

USA . 2,965 parts In-Stock

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2,965

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Vyrian

USA . 1,982 parts In-Stock

1+ parts

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1,982

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Anansix

USA . 258 parts In-Stock

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258

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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LWI Electronics Inc

India . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$3.906

100+ parts

-

1k+ parts

$3.516

10k+ parts

-

2,324

$3.906

-

$3.516

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Microchip USA

USA . 158 parts In-Stock

1+ parts

$5.635

100+ parts

-

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158

$5.635

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MKK Technologies

India . 3 parts In-Stock

1+ parts

$7.346

100+ parts

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3

$7.346

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DigiPath Technology Company

USA . 3 parts In-Stock

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$7.346

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-

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3

$7.346

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-

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$11.250

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613

$11.250

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A-Z Elektronik GmbH

Germany . 6,878 parts In-Stock

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6,878

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Corphita

USA . 4,781 parts In-Stock

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4,781

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Vigor

Singapore . 4,066 parts In-Stock

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Kepictronics

USA . 1,290 parts In-Stock

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1,290

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Parana Technologies

USA . 1,270 parts In-Stock

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$4.671

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1,270

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$4.671

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Perfect Parts

USA . 969 parts In-Stock

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969

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Cyclops Electronics Ltd (Excess)

UK . 415 parts In-Stock

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415

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Overview

Elevate your projects with the TSH73CD by STMicroelectronics, a high-quality operational amplifier designed to deliver unparalleled performance. With STMicroelectronics' reputation for excellence in semiconductor manufacturing, you can trust that this product offers reliability and precision. Whether you're working on audio equipment, signal processing systems, or instrumentation, the TSH73CD's advanced features and compact design will provide you with the value, benefits, and advantages you need to bring your ideas to life. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the operational amplifier, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easier and more convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in a single operational amplifier provides versatility and flexibility in circuit design, allowing for more efficient use of resources.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and standardized, making it compatible with various PCB layouts and easily mountable.

No. of Terminals: 14

The high number of terminals allows for connections to multiple external components, enabling complex circuit configurations and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance, promoting long-term reliability and stable performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting orientation, allowing for different PCB layout options and ease of installation.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact design and reduces the overall profile of the operational amplifier, saving space in tight applications.

Width: 3.9 mm

Narrow width facilitates close placement of components on the PCB, optimizing board space and enabling efficient circuit design.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures proper soldering and thermal stability during assembly, preventing damage to the operational amplifier.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C meets industry standards for soldering processes, ensuring reliable and durable connections in manufacturing.

Length: 8.65 mm

The compact length of 8.65 mm contributes to a small overall footprint of the operational amplifier, enabling space-efficient designs in compact electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the operational amplifier is suitable for standard operating conditions in commercial applications, offering reliable performance in typical environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical support during assembly, ensuring stability and durability in various mounting orientations.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is designed for precision signal processing and amplification, making it ideal for a wide range of applications in electronics and instrumentation.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm allows for easy connection to standard PCB layouts and components, simplifying the integration of the operational amplifier in circuit designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSH73CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

3

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH73CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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