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TSH72CD

STMicroelectronics

TSH72CD by STMicroelectronics

TSH72CD by STMicroelectronics is a dual operational amplifier with 8 terminals in a small outline package. It features a peak reflow temperature of 260 °C and is suitable for commercial-grade applications. With a terminal pitch of 1.27mm, it is ideal for surface mount designs requiring high-performance op amps.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,103 parts In-Stock

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4,103

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Digiode

USA . 749 parts In-Stock

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749

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Anansix

USA . 656 parts In-Stock

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656

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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300

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ComSIT USA

USA . 200 parts In-Stock

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200

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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LWI Electronics Inc

India . 99 parts In-Stock

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99

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ECAB

Sweden . 92 parts In-Stock

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92

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 192 parts In-Stock

1+ parts

$6.392

100+ parts

-

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$5.753

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192

$6.392

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$5.753

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Microchip USA

USA . 356 parts In-Stock

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$7.464

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356

$7.464

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AZTECH Wire

Italy . 686 parts In-Stock

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$9.610

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686

$9.610

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MKK Technologies

India . 1,000 parts In-Stock

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$12.020

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$12.020

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DigiPath Technology Company

USA . 1,000 parts In-Stock

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$12.020

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$12.020

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,080 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,761 parts In-Stock

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Parana Technologies

USA . 2,247 parts In-Stock

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$7.643

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Vigor

Singapore . 1,362 parts In-Stock

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Perfect Parts

USA . 782 parts In-Stock

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Kepictronics

USA . 589 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 300 parts In-Stock

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Glotronic Ltd.

UK . 240 parts In-Stock

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Corphita

USA . 186 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Enhance your electronic designs with the STMicroelectronics TSH72CD Operational Amplifiers. Crafted by a reputable manufacturer, this dual-function amplifier offers unparalleled quality and reliability for your projects. With a compact package design and superior performance, the TSH72CD is perfect for a wide range of applications in various industries. Experience the value and benefits of this high-quality product today, and unlock endless possibilities for your next innovation. Trust STMicroelectronics to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the operational amplifier, ensuring long-term reliability and durability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in one package can help reduce the overall circuit complexity and component count, leading to cost savings and improved efficiency.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the operational amplifier into various electronic designs and layouts.

No. of Terminals: 8

Provides sufficient connections for input and output signals, power supply, and other necessary connections, allowing for versatile usage in different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables compact designs without compromising on performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish combination ensures good conductivity, corrosion resistance, and long-term reliability, enhancing the overall performance and lifespan of the operational amplifier.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and installation, catering to different PCB layouts and space constraints.

Maximum Seated Height: 1.75 mm

The low seated height is beneficial for applications with height restrictions, enabling compact and slim designs.

Width: 3.9 mm

The narrow width of the operational amplifier facilitates space-saving integration in densely populated PCBs and tight electronic assemblies.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps prevent overheating and damage to the operational amplifier during the soldering process, ensuring reliable operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the operational amplifier suitable for lead-free soldering processes, meeting modern industrial standards.

Length: 4.9 mm

The compact length of the operational amplifier contributes to space-efficient designs and easy integration into various electronic devices and systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade is suitable for typical operating conditions in commercial electronic equipment, providing reliable performance in various applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and secure soldering, ensuring strong connections and enhanced durability of the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and widely used in various electronic circuits for amplification, signal processing, and other applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch enables compatibility with common PCB layouts and facilitates ease of assembly and soldering for efficient production processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSH72CD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH72CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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