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TS944BIN

STMicroelectronics

TS944BIN by STMicroelectronics

TS944BIN by STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 5000 µV, low bias current of 0.15 nA, and operates within a supply range of 3-12 V. Ideal for industrial applications, it offers high CMRR at 85 dB and micropower efficiency. Its compact design with 14 terminals ensures easy integration in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,666 parts In-Stock

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5,666

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Anansix

USA . 2,059 parts In-Stock

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2,059

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Digiode

USA . 1,561 parts In-Stock

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1,561

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$5.112

100+ parts

-

1k+ parts

$4.600

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-

1,914

$5.112

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$4.600

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Microchip USA

USA . 426 parts In-Stock

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$6.521

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426

$6.521

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MKK Technologies

India . 454 parts In-Stock

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$9.612

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454

$9.612

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DigiPath Technology Company

USA . 454 parts In-Stock

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$9.612

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454

$9.612

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AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$17.730

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245

$17.730

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Corphita

USA . 4,415 parts In-Stock

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4,415

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Vigor

Singapore . 1,739 parts In-Stock

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1,739

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Parana Technologies

USA . 50 parts In-Stock

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$6.112

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50

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$6.112

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Overview

Unlock precision and reliability in your designs with the TS944BIN operational amplifier from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers unmatched performance in a compact package, perfect for industrial applications where efficiency matters. Benefit from exceptional low bias currents and wide voltage compatibility, ensuring your projects achieve peak performance without compromising on power. Elevate your innovations with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body offers durability and protection, making it well-suited for various applications.

Maximum Input Offset Voltage: 5000 uV

The low input offset voltage ensures high accuracy, minimizing errors in sensitive applications.

Maximum Average Bias Current (IIB): 0.00015 uA

The ultra-low average bias current contributes to enhanced battery life in portable and low-power designs.

No. of Functions: 4

Having four functions provides versatility, making it adaptable for multiple configurations and applications.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and suitable for a variety of layouts, enhancing design flexibility.

Nominal Common Mode Reject Ratio: 85 dB

A high common mode reject ratio improves noise rejection, which is critical for precision in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

The low nominal supply voltage is ideal for battery-operated devices, ensuring energy efficiency.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V supplies offers design flexibility for a range of applications.

No. of Terminals: 14

With 14 terminals, this op amp supports complex circuits while maintaining a compact design.

Package Style (Meter): IN-LINE

The in-line package style simplifies PCB layout and offers ease of integration into existing designs.

Maximum Supply Voltage Limit: 12 V

The 12V maximum supply voltage enhances the range of applications by allowing more robust designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for industrial and harsh environments.

Maximum Bias Current (IIB) @25°C: 0.00015 uA

This low bias current at room temperature further improves accuracy in precision applications.

Frequency Compensation: YES

Frequency compensation ensures stable operation across different frequencies, improving performance in dynamic conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this op amp is reliable for extreme temperature applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and protects against corrosion, improving longevity.

Terminal Position: DUAL

The dual terminal position allows for better connection layouts and simplifies circuit design.

Maximum Seated Height: 5.1 mm

A low seated height allows for compact assembly and is suitable for space-constrained applications.

Width: 7.62 mm

The narrow width enhances the ability to fit into tightly packed PCBs while ensuring functionality.

Micropower: YES

Micropower consumption makes this op amp ideal for low-power and battery-operated applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in a wide range of operating conditions.

Low-Bias: YES

Low-bias characteristics enhance overall accuracy and precision, especially important for signal processing.

Nominal Unity Gain Bandwidth: 10 kHz

A nominal unity gain bandwidth of 10 kHz ensures sufficient frequency response for a variety of applications.

Technology: BICMOS

Utilizing BICMOS technology combines benefits from both bipolar and CMOS processes for improved performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, making them ideal for durable applications.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile for amplification, filtering, and signal processing tasks.

Maximum Supply Current: 0.0074 mA

The low supply current extends battery life and is vital for energy-sensitive applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stable performance across a range of applications and conditions.

Packing Method: TUBE

Packaging in tubes facilitates easy handling and storage, ensuring safe transport to assembly lines.

Nominal Slow Rate: 4500 V/us

A high nominal slew rate enables rapid response to input signal changes, enhancing performance in fast applications.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is a standard size that offers compatibility with many PCB design layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TS944BIN attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

5000 uV

Nominal Slew Rate:

4500 V/us

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

150 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

7.4 μA

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.201 in (5.1 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TS944BIN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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