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TS941BIDT

STMicroelectronics

TS941BIDT by STMicroelectronics

TS941BIDT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 2000 µV and an impressive common mode reject ratio of 85 dB. It operates within a supply range of 3-12 V, making it ideal for industrial applications. Its compact design and low bias current enhance performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,394 parts In-Stock

1+ parts

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3,394

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Anansix

USA . 2,584 parts In-Stock

1+ parts

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2,584

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Digiode

USA . 812 parts In-Stock

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812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$1.983

100+ parts

-

1k+ parts

$1.784

10k+ parts

-

1,433

$1.983

-

$1.784

-

MKK Technologies

India . 2,139 parts In-Stock

1+ parts

$3.728

100+ parts

-

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2,139

$3.728

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DigiPath Technology Company

USA . 2,139 parts In-Stock

1+ parts

$3.728

100+ parts

-

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-

10k+ parts

-

2,139

$3.728

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-

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Semicontronic

India . 188 parts In-Stock

1+ parts

$8.410

100+ parts

$8.200

1k+ parts

$8.158

10k+ parts

-

188

$8.410

$8.200

$8.158

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Microchip USA

USA . 5,435 parts In-Stock

1+ parts

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5,435

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Corphita

USA . 3,866 parts In-Stock

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3,866

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Vigor

Singapore . 1,564 parts In-Stock

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1,564

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Parana Technologies

USA . 1,458 parts In-Stock

1+ parts

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$2.370

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1,458

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$2.370

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Overview

Elevate your designs with the TS941BIDT operational amplifier from STMicroelectronics, a trusted leader in innovation. This high-quality component delivers exceptional performance, featuring low bias current and impressive common mode rejection. Ideal for diverse applications—from industrial sensors to consumer electronics—its micropower capabilities ensure efficiency without compromising reliability. Choose TS941BIDT and experience unmatched value that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures long-lasting performance and reliability.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage contributes to high accuracy in signal amplification.

Maximum Average Bias Current (IIB): 0.00015 uA

Extremely low bias current minimizes error and increases precision in sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape is ideal for space-efficient PCB designs.

Nominal Common Mode Reject Ratio: 85 dB

A high CMRR ensures excellent performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

Low supply voltage requirement makes this op-amp suitable for battery-powered applications.

Power Supplies (V): 3/5

Versatile power supply options enhance design flexibility for various applications.

No. of Terminals: 8

Sufficient terminals for various configurations and ease of integration into different designs.

Package Style (Meter): SMALL OUTLINE

Small outline package suits compact devices and modern electronics.

Maximum Supply Voltage Limit: 12 V

A generous supply voltage limit makes it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

High operating temperature rating allows for use in demanding environments.

Maximum Bias Current (IIB) @ 25C: 0.00015 uA

Consistency in bias current minimizes offset errors across different temperatures.

Frequency Compensation: YES

Integrated frequency compensation ensures stable operation without external components.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and long-term reliability.

Terminal Position: DUAL

Dual-terminal design facilitates lower parasitic losses and better signal integrity.

Maximum Seated Height: 1.75 mm

Low height aids in compact circuit board designs.

Width: 3.9 mm

Narrow width tailored for high-density mounting configurations.

Micropower: YES

Micropower consumption makes it ideal for energy-sensitive applications.

Length: 4.9 mm

Compact length enables space-efficient layout on PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in harsh conditions.

Low-Bias: YES

Low-bias design offers enhanced precision for critical measurements.

Nominal Unity Gain Bandwidth: 10 kHz

Adequate bandwidth supports various signal processing tasks without distortion.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies for improved performance.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and ease of assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier is versatile for a variety of analog signal processing applications.

Maximum Supply Current: 0.00185 mA

Extremely low supply current contributes to energy efficiency in portable devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture supports wide application scenarios with low distortion.

Packing Method: TAPE AND REEL

Tape and reel packaging enhances automated assembly processes.

Nominal Slow Rate: 4500 V/us

High slew rate facilitates fast signal response, critical for dynamic applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies layout and design for compatibility with various PCBs.

Technical Specifications

Operational Amplifiers (Op Amps) TS941BIDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

2000 uV

Nominal Slew Rate:

4500 V/us

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

150 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

1.85 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS941BIDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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