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TS941BILT

STMicroelectronics

TS941BILT by STMicroelectronics

TS941BILT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 2000 µV and a common mode reject ratio of 85 dB. It operates b/w -40 °C to 85°C, making it ideal for industrial applications. Its compact size and low bias current enhance performance in space-constrained designs.

Median Price

$111.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 3,000 parts In-Stock

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-

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$111.000

3,000

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$111.000

Distributors (In-Stock)

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Vyrian

USA . 880 parts In-Stock

1+ parts

$111.000

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-

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880

$111.000

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Digiode

USA . 2,458 parts In-Stock

1+ parts

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2,458

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Anansix

USA . 2,235 parts In-Stock

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2,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 450 parts In-Stock

1+ parts

$5.203

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-

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450

$5.203

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IDEA Electronic Components Group

UK . 1,844 parts In-Stock

1+ parts

$6.055

100+ parts

-

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$5.450

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-

1,844

$6.055

-

$5.450

-

MKK Technologies

India . 2,146 parts In-Stock

1+ parts

$11.387

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2,146

$11.387

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DigiPath Technology Company

USA . 2,146 parts In-Stock

1+ parts

$11.387

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2,146

$11.387

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Assy Fe

Spain . 30,000 parts In-Stock

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Vigor

Singapore . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,154 parts In-Stock

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Corphita

USA . 4,451 parts In-Stock

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Kepictronics

USA . 3,859 parts In-Stock

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3,859

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Component Stockers USA

USA . 1,855 parts In-Stock

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1,855

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Parana Technologies

USA . 205 parts In-Stock

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$7.240

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205

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$7.240

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Overview

Experience precision and reliability with the TS941BILT operational amplifier from STMicroelectronics—a leader in innovative semiconductor solutions. Crafted for optimal performance, this low-power, surface-mount op-amp excels in diverse applications, including industrial automation and sensor interfacing. Trust in STMicroelectronics' commitment to quality and efficiency, ensuring your designs achieve remarkable accuracy while minimizing energy consumption. Elevate your projects with the TS941BILT!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures the product's longevity and reliability in various applications.

Maximum Input Offset Voltage: 2000 uV

A low input offset voltage enhances accuracy, making this op amp suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00015 uA

This low bias current minimizes error and increases precision in low-power circuits.

Surface Mount: YES

Being surface-mount compatible allows for easy integration into compact designs and automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient board layouts and minimizes wasted space.

Nominal Common Mode Reject Ratio: 85 dB

A high CMRR ensures that the op amp performs reliably in noisy environments, providing better signal integrity.

Nominal Supply Voltage / Vsup (V): 3

A low nominal supply voltage allows for battery-operated designs and energy-efficient applications.

Power Supplies (V): 3/5

Flexibility in power supply options facilitates use in various electronic systems.

No. of Terminals: 5

The 5-terminal configuration supports a range of design applications without unnecessary complexity.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design is suitable for space-constrained applications, contributing to smaller device sizes.

Maximum Supply Voltage Limit: 12 V

A higher supply voltage limit allows for versatility in operating range, supporting various circuit designs.

Maximum Operating Temperature: 85 °C

A wide temperature range ensures reliable operation in harsh environments, making it ideal for industrial applications.

Maximum Bias Current (IIB) @25 °C: 0.00015 uA

Consistently low bias current guarantees precision, especially in sensitive analog applications.

Frequency Compensation: YES

Integrated frequency compensation simplifies design efforts by stabilizing the amplifier's response.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures expands applicability in extreme environments.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and provides protection against corrosion.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible layout options on PCB designs.

Maximum Seated Height: 1.45 mm

A low seated height benefits applications with strict height constraints.

Width: 1.6 mm

Narrow width allows for high-density circuit designs, optimizing space on the PCB.

Micropower: YES

Micropower operation significantly increases battery life in portable applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended heat resistance during reflow soldering ensures reliability and performance integrity.

Peak Reflow Temperature (°C): 260

This high peak reflow temperature compatible op amp withstands modern soldering processes without damage.

Length: 2.9 mm

Compact length supports dense PCB layouts, contributing to smaller overall product sizes.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robustness and reliability in a variety of demanding environments.

Low-Bias: YES

Low-bias characteristics make this op amp ideal for precision measurement systems and instrumentation.

Nominal Unity Gain Bandwidth: 10 kHz

The op amp's responsive bandwidth is suitable for a wide range of audio and signal processing applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS processes, enhancing performance and efficiency.

Terminal Form: GULL WING

The gull-wing terminals provide excellent mechanical strength and ease of handling during assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are fundamental components in analog electronics, critical for signal amplification and processing.

Maximum Supply Current: 0.00185 mA

Minimal supply current makes this product suitable for energy-sensitive applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is versatile and widely used in various signal processing tasks.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly for increased manufacturing efficiency.

Nominal Slow Rate: 4500 V/us

High slew rate enables quick response to input changes, making this op amp suitable for fast applications.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch is compatible with modern PCB manufacturing processes, supporting high-density layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TS941BILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

2000 uV

Nominal Slew Rate:

4500 V/us

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

150 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.85 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TS941BILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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