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OPA129UB

Texas Instruments

OPA129UB by Texas Instruments

OPA129UB by Texas Instruments is an operational amplifier with a max input offset voltage of 2000uV, 118dB common mode reject ratio, and 1.8mA max supply current. Ideal for automotive applications due to its low-bias design and high slew rate of 2.5V/us in a small outline package.

Median Price

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Lifecycle Status

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6

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1k+

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Digiode

USA . 4,577 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Nova Conductors

Japan . 48 parts In-Stock

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Kiltronic GmbH

Germany . 11 parts In-Stock

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Legend Electronics Inc.

USA . 2 parts In-Stock

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Parana Technologies

USA . 607 parts In-Stock

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$2.179

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$202.327

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$1.961

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607

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$1.961

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DigiPath Technology Company

USA . 931 parts In-Stock

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$2.399

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931

$2.399

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ChromeModa Solutions

Germany . 6,948 parts In-Stock

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$2.448

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$2.007

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$2.448

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IDEA Electronic Components Group

UK . 763 parts In-Stock

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$2.448

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$2.203

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Corohmni

South Africa . 115 parts In-Stock

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$2.983

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One Stop Electronics

USA . 1,446 parts In-Stock

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$3.410

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$6.271

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$5.957

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$5.957

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AZTECH Wire

Italy . 756 parts In-Stock

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$13.723

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Corphita

USA . 5,267 parts In-Stock

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Continental Prestige Electronics

USA . 4,626 parts In-Stock

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Authorized Procurement Solutions

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Epart123

USA . 3,000 parts In-Stock

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$14.410

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$13.100

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$13.100

A-Z Elektronik GmbH

Germany . 2,775 parts In-Stock

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Perfect Parts

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Kepictronics

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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$0.394

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S.R.D Solutions

India . 710 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Microchip USA

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Overview

Enhance your electronic designs with the OPA129UB Operational Amplifier by Texas Instruments. With a sleek rectangular package body made of plastic/epoxy, this op amp offers exceptional performance and precision. Ideal for automotive applications, this amplifier features a low-bias design and a wide operating temperature range from -40 to 125°C. Delivering a nominal common mode reject ratio of 118 dB and a minimum voltage gain of 50,000, the OPA129UB ensures reliable and high-quality signal processing. Trust Texas Instruments for cutting-edge technology and unmatched value in operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for applications where weight and robustness are important factors.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures high accuracy and precision in signal processing applications.

Maximum Average Bias Current (IIB): 0.0000001 uA

Extremely low bias current minimizes signal distortion and ensures high signal integrity.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving in compact electronic devices.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into circuit designs and PCB layouts efficiently.

Nominal Common Mode Reject Ratio: 118 dB

High common mode rejection ratio ensures effective rejection of common mode noise for cleaner output signals.

Nominal Supply Voltage / Vsup (V): 15

Compatible with a wide range of supply voltages, providing flexibility in different operating conditions.

Power Supplies (V): +-15

Ability to support dual power supplies for versatile applications requiring positive and negative voltage requirements.

No. of Terminals: 8

Sufficient number of terminals for easy connectivity and interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving design for applications where board space is limited.

Technical Specifications

Operational Amplifiers (Op Amps) OPA129UB attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

118 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.5 V/us

Peak Bias Current:

0.1 pA

Maximum Bias Current (IIB) @25 °C:

0.1 pA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

1.8 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA129UB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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