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TS941AIDT

STMicroelectronics

TS941AIDT by STMicroelectronics

TS941AIDT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 5000 µV, ideal for low-power applications. It operates within a supply range of 3-12 V and features an impressive common mode reject ratio of 85 dB. This compact, surface-mount device is suitable for industrial use in temperature extremes from -40 °C to 85°C.

Median Price

$0.874

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$0.874

100+ parts

-

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10k+ parts

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550

$0.874

-

-

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Vyrian

USA . 4,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,020

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Digiode

USA . 3,020 parts In-Stock

1+ parts

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3,020

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Anansix

USA . 1,744 parts In-Stock

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-

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1,744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$3.528

100+ parts

-

1k+ parts

$3.175

10k+ parts

-

1,542

$3.528

-

$3.175

-

MKK Technologies

India . 128 parts In-Stock

1+ parts

$6.635

100+ parts

-

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128

$6.635

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DigiPath Technology Company

USA . 128 parts In-Stock

1+ parts

$6.635

100+ parts

-

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10k+ parts

-

128

$6.635

-

-

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AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$16.670

100+ parts

-

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10k+ parts

-

439

$16.670

-

-

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Vigor

Singapore . 8,641 parts In-Stock

1+ parts

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8,641

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Corphita

USA . 4,378 parts In-Stock

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4,378

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Microchip USA

USA . 4,362 parts In-Stock

1+ parts

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4,362

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Parana Technologies

USA . 1,147 parts In-Stock

1+ parts

-

100+ parts

$4.218

1k+ parts

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1,147

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$4.218

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Overview

Experience precision like never before with the TS941AIDT from STMicroelectronics, a leader in innovation and quality. This micropower operational amplifier is designed for exceptional performance in demanding applications, ensuring reliability across various industrial settings. With its low bias current and robust temperature range, it delivers optimal efficiency while minimizing energy consumption. Elevate your projects with a trusted component that promises unmatched value and superior results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components, making it suitable for various applications.

Maximum Input Offset Voltage: 5000 uV

A low input offset voltage minimizes signal error, ensuring high precision in applications requiring accurate signal processing.

Maximum Average Bias Current (IIB): 0.00015 uA

With a very low bias current, this Op Amp is ideal for high-impedance applications, preventing significant loading effects.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient space utilization on PCBs, making it easier to design compact systems.

Nominal Common Mode Reject Ratio: 85 dB

A high CMRR indicates strong resistance to common-mode signals, improving signal integrity in noisy environments.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V allows for energy-efficient designs, particularly in battery-powered applications.

Power Supplies (V): 3/5

The ability to operate with both 3V and 5V power supplies offers flexibility in design, accommodating various system requirements.

No. of Terminals: 8

An 8-terminal configuration provides ample connectivity for versatile applications while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save board space, making it suitable for compact electronic devices.

Maximum Supply Voltage Limit: 12 V

Supports a maximum supply voltage of 12V, allowing for a wide range of operational designs without risk of damage.

Maximum Operating Temperature: 85 °C

Designed to operate at high temperatures, this Op Amp is suitable for industrial applications where ambient conditions are challenging.

Maximum Bias Current (IIB) @25°C: 0.00015 uA

Maintaining a low bias current at 25 °C ensures consistent performance and accuracy across varying temperature conditions.

Frequency Compensation: YES

Built-in frequency compensation improves stability and response time, making it reliable for high-frequency applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this Op Amp is suitable for harsh environmental conditions and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish promotes excellent solderability and reliable connections, enhancing long-term performance.

Terminal Position: DUAL

Dual terminal positioning facilitates convenient layout options on PCBs, improving design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height supports low-profile designs, reducing overall device thickness.

Width: 3.9 mm

Its compact width allows for high-density circuit design, making it an excellent choice for space-constrained applications.

Micropower: YES

Being micropower rated contributes to energy efficiency, extending battery life in portable devices.

Length: 4.9 mm

Short overall length further contributes to compact design possibilities, ideal for miniaturized devices.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, ensuring reliability and robustness under demanding conditions.

Low-Bias: YES

Low-bias characteristics enhance performance in sensitive applications, reducing measurement errors.

Nominal Unity Gain Bandwidth: 10 kHz

A unity-gain bandwidth of 10 kHz provides sufficient bandwidth for a variety of signal amplification tasks.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS processes, ensuring high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide a reliable soldering surface for enhanced mechanical and electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile and can be used in a wide range of applications, such as signal conditioning and filtering.

Maximum Supply Current: 0.00185 mA

Low supply current helps to conserve energy, making the Op Amp ideal for battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture enhances linearity and makes the Op Amp perfectly suitable for wide-ranging analog applications.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly processes, increasing production speed and efficiency.

Nominal Slope Rate: 4500 V/us

A high slope rate of 4500 V/µs allows for rapid signal processing, making it suitable for high-speed applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easier soldering and placement on PCBs, enhancing manufacturability.

Technical Specifications

Operational Amplifiers (Op Amps) TS941AIDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

5000 uV

Nominal Slew Rate:

4500 V/us

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

150 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

1.85 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS941AIDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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