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TS931ADT

STMicroelectronics

TS931ADT by STMicroelectronics

TS931ADT by STMicroelectronics is an Operational Amplifier with a max input offset voltage of 5000 uV, low-bias and micropower features. It operates on power supplies of 3/5 V, suitable for applications requiring voltage-feedback architecture in small outline packages. This amplifier is ideal for surface mount designs due to its gull wing terminal form and nickel/palladium/gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,922

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-

-

-

Vyrian

USA . 1,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,165

-

-

-

-

Anansix

USA . 137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

137

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 995 parts In-Stock

1+ parts

$6.385

100+ parts

-

1k+ parts

$5.746

10k+ parts

-

995

$6.385

-

$5.746

-

MKK Technologies

India . 2,076 parts In-Stock

1+ parts

$12.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,076

$12.006

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-

-

DigiPath Technology Company

USA . 2,076 parts In-Stock

1+ parts

$12.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,076

$12.006

-

-

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Corphita

USA . 3,685 parts In-Stock

1+ parts

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1k+ parts

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3,685

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Parana Technologies

USA . 609 parts In-Stock

1+ parts

-

100+ parts

$7.634

1k+ parts

-

10k+ parts

-

609

-

$7.634

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Overview

Discover the TS931ADT by STMicroelectronics, a high-quality operational amplifier designed to meet your circuit needs. Manufactured by STMicroelectronics, a trusted name in the industry, this versatile Op Amp offers low power consumption and precision performance. Ideal for a wide range of applications, from audio amplification to sensor signal conditioning, the TS931ADT provides reliable operation and easy integration into your projects. Experience the value and benefits of this advanced amplifier, delivering exceptional results with minimal power consumption. Choose the TS931ADT for your next project and see the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective without compromising on durability.

Maximum Input Offset Voltage: 5000 uV

The low input offset voltage ensures high precision and accuracy in signal processing applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy placement and orientation on circuit boards, enhancing overall design flexibility.

Power Supplies (V): 3/5

Operating with dual power supplies of 3V and 5V provides versatility in different voltage scenarios, making it suitable for a wide range of applications.

No. of Terminals: 8

With 8 terminals, the operational amplifier offers multiple input and output options for increased functionality and connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable space on the PCB, making it ideal for compact electronic devices.

Maximum Supply Voltage Limit: 12 V

With a maximum supply voltage limit of 12V, the operational amplifier can safely operate within a wide voltage range, enhancing its stability and reliability.

Frequency Compensation: YES

The presence of frequency compensation ensures stability and prevents oscillations, making the amplifier suitable for high-frequency applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options, accommodating different circuit configurations and requirements.

Micropower: YES

The micropower feature enables low power consumption, making the operational amplifier suitable for battery-operated or power-sensitive applications.

Low-Bias: YES

Low-bias operation minimizes input offset current, improving accuracy and precision in signal amplification and processing.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and fast switching speeds.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and easy handling during assembly, enhancing overall product reliability and durability.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, the product is specifically designed for amplifying and processing signals with high accuracy and stability, making it an ideal choice for various signal conditioning applications.

Maximum Supply Current: 0.031 mA

Having a low maximum supply current of 0.031 mA ensures efficient power consumption and minimizes heat dissipation, contributing to overall system reliability.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture offers superior noise performance, high bandwidth, and stable operation, making the operational amplifier suitable for demanding signal processing tasks.

Packing Method: TAPE AND REEL

The tape and reel packing method facilitates automated pick-and-place assembly, streamlining mass production processes and reducing assembly time.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and reliable solder connections, ensuring proper signal transmission and minimizing signal loss in the circuit.

Technical Specifications

Operational Amplifiers (Op Amps) TS931ADT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Input Offset Voltage Limit:

5000 uV

Operational Characteristics

Maximum Supply Voltage:

12 V

Maximum Supply Current:

31 μA

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS931ADT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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