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TS4890IQT

STMicroelectronics

TS4890IQT by STMicroelectronics

TS4890IQT by STMicroelectronics is a compact audio amplifier with 1W output power, operating b/w 2.2V and 5.5V. It features low harmonic distortion at 1% and operates in extreme temperatures from -40 °C to 85°C. Ideal for industrial audio applications, its small footprint ensures efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,452 parts In-Stock

1+ parts

-

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7,452

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Digiode

USA . 4,899 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,899

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Anansix

USA . 1,115 parts In-Stock

1+ parts

-

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-

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1,115

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 896 parts In-Stock

1+ parts

$1.553

100+ parts

-

1k+ parts

$1.398

10k+ parts

-

896

$1.553

-

$1.398

-

MKK Technologies

India . 501 parts In-Stock

1+ parts

$2.920

100+ parts

-

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-

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501

$2.920

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DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$2.920

100+ parts

-

1k+ parts

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-

501

$2.920

-

-

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Microchip USA

USA . 257 parts In-Stock

1+ parts

$8.145

100+ parts

-

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257

$8.145

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AZTECH Wire

Italy . 922 parts In-Stock

1+ parts

$10.020

100+ parts

-

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922

$10.020

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Component Stockers USA

USA . 474 parts In-Stock

1+ parts

$99.990

100+ parts

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474

$99.990

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Parana Technologies

USA . 560 parts In-Stock

1+ parts

-

100+ parts

$1.857

1k+ parts

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560

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$1.857

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Corphita

USA . 474 parts In-Stock

1+ parts

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474

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Overview

Elevate your audio experience with the TS4890IQT from STMicroelectronics, a leader in innovation and quality. Designed for compact applications, this high-performance amplifier delivers crystal-clear sound while maintaining impressive efficiency. With its small footprint and robust temperature range, it's perfect for a variety of audio and video devices. Trust in STMicroelectronics to provide superior reliability and performance, enhancing your projects with seamless integration and exceptional audio fidelity.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact and space-constrained applications.

Package Shape: SQUARE

The square package shape enhances the stability and performance of the amplifier, allowing for efficient use of PCB space.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is specifically designed to enhance sound quality, making it ideal for audio applications.

Harmonic Distortion: 1 %

With low harmonic distortion, the amplifier ensures high-fidelity audio reproduction, resulting in a clearer and more enjoyable listening experience.

Power Supplies (V): 2.2/5

The ability to operate on a wide voltage range (2.2V to 5V) makes this amplifier versatile for various electronic applications.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for integration into different circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The thin profile and heat sink design improve thermal efficiency and allow it to fit into dense layouts, maintaining reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications with demanding environmental conditions.

Minimum Operating Temperature: -40 °C

With the capability to function in low temperatures, this amplifier can operate effectively in extreme environments.

Terminal Finish: MATTE TIN

The matte tin finish ensures reliable soldering and corrosion resistance, enhancing long-term durability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible and efficient PCB layout designs, facilitating easier assembly.

Nominal Output Power: 1 W

A nominal output power of 1W is sufficient for delivering quality audio in small to medium-sized applications.

Maximum Seated Height: 1 mm

The low seated height is ideal for slim device designs where space is critical.

Width: 3 mm

A compact width allows for tighter placement on PCBs, making this amplifier ideal for miniaturized devices.

Minimum Supply Voltage (Vsup): 2.2 V

The low minimum supply voltage enables the use of small batteries in portable applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures compatibility with modern assembly techniques, allowing for efficient manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates durability and resilience during soldering processes.

Length: 3 mm

The short length contributes to its compact footprint, enabling integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature use, this amplifier is built to withstand harsh environments and provide reliable performance.

Technology: BIPOLAR

Bipolar technology allows for better linearity and lower noise, contributing to enhanced audio performance.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, the amplifier is designed to provide clear low-frequency response, suitable for various audio applications.

Terminal Form: NO LEAD

No-lead terminal forms reduce space requirements and improve reliability in soldering, making it suitable for modern manufacturing techniques.

Maximum Supply Current: 8 mA

The low maximum supply current enhances power efficiency, making this amplifier suitable for battery-operated devices.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for denser component arrangements on PCBs, making it ideal for compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to support up to 5.5V ensures compatibility with various power management systems in audio devices.

Technical Specifications

Audio & Video Amplifiers TS4890IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.2/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TS4890IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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