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TS4871EIDT

STMicroelectronics

TS4871EIDT by STMicroelectronics

TS4871EIDT by STMicroelectronics is a compact audio amplifier with a nominal output power of 1 W and operates within -40 °C to 85°C. It features low harmonic distortion at 1% and supports supply voltages from 2.5 V to 5.5 V, ideal for industrial audio applications. Its small outline design ensures easy surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,225 parts In-Stock

1+ parts

-

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8,225

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Anansix

USA . 2,284 parts In-Stock

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2,284

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Digiode

USA . 1,332 parts In-Stock

1+ parts

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1,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,844 parts In-Stock

1+ parts

$2.733

100+ parts

-

1k+ parts

$2.460

10k+ parts

-

1,844

$2.733

-

$2.460

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MKK Technologies

India . 345 parts In-Stock

1+ parts

$5.140

100+ parts

-

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345

$5.140

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$5.140

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345

$5.140

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Microchip USA

USA . 344 parts In-Stock

1+ parts

$7.225

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344

$7.225

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AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$8.870

100+ parts

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730

$8.870

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 5,786 parts In-Stock

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5,786

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Kepictronics

USA . 2,342 parts In-Stock

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2,342

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Corphita

USA . 1,691 parts In-Stock

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1,691

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Parana Technologies

USA . 876 parts In-Stock

1+ parts

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100+ parts

$3.268

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876

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$3.268

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Overview

Elevate your audio experience with the TS4871EIDT from STMicroelectronics, a leader in innovative technology. This high-quality audio amplifier combines compact design and exceptional performance, delivering clear sound even in challenging environments. With its robust temperature range and reliability, it's perfect for industrial applications. Benefit from enhanced audio clarity and efficiency, making it an invaluable addition to your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the robustness and durability of the amplifier, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, enabling compact designs in audio applications.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for effective circuit layout and design flexibility.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed to enhance audio signals, ensuring high-performance output for sound applications.

Harmonic Distortion: 1 %

With only 1% harmonic distortion, this amplifier ensures clean audio reproduction, delivering high-fidelity sound quality.

No. of Terminals: 8

The 8-terminal configuration allows for versatile connectivity options, facilitating easier integration into various audio systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes high-density circuit design, making it ideal for portable audio equipment.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliable performance even under higher temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier is suitable for harsh environments, ensuring performance in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout designs, which is beneficial for complex and compact PCB designs.

Nominal Output Power: 1 W

Delivering a nominal output power of 1W, this amplifier is suitable for driving small speakers effectively in consumer electronics.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm contributes to slimline electronic designs, ideal for space-constrained applications.

Width: 3.9 mm

The compact width of 3.9 mm allows for integration in tight spaces, making it ideal for modern electronics where space is a premium.

Minimum Supply Voltage (Vsup): 2.5 V

A low minimum supply voltage of 2.5V makes this amplifier highly efficient, suitable for battery-operated devices.

Length: 4.9 mm

The length of 4.9 mm contributes to its compact form factor, facilitating high-density designs in a variety of audio equipment.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this amplifier ensures reliable performance across a wide range of operating conditions.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz aligns with audio requirements, enabling clear and effective sound amplification for various audio sources.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and solderability, ensuring robust connections in circuit assemblies.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with standard PCB layouts, facilitating easier assembly and design processes.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5V affords flexibility in input power options, allowing for versatility in various applications.

Technical Specifications

Audio & Video Amplifiers TS4871EIDT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TS4871EIDT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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