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TS487-1IQT

STMicroelectronics

TS487-1IQT by STMicroelectronics

TS487-1IQT by STMicroelectronics is a compact audio amplifier with a dual-channel design, operating b/w 2.5V and 5.5V. It features an industrial temperature range of -40 °C to 85 °C and delivers nominal output power of 0.108W. Ideal for space-constrained audio applications, it comes in a small outline package with no lead terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,057 parts In-Stock

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5,057

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Digiode

USA . 921 parts In-Stock

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921

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Anansix

USA . 604 parts In-Stock

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604

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 424 parts In-Stock

1+ parts

$0.942

100+ parts

-

1k+ parts

$0.848

10k+ parts

-

424

$0.942

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$0.848

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MKK Technologies

India . 71 parts In-Stock

1+ parts

$1.772

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71

$1.772

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DigiPath Technology Company

USA . 71 parts In-Stock

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$1.772

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71

$1.772

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Microchip USA

USA . 330 parts In-Stock

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$6.637

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330

$6.637

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AZTECH Wire

Italy . 334 parts In-Stock

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$19.070

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334

$19.070

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A-Z Elektronik GmbH

Germany . 12,084 parts In-Stock

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12,084

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 3,118 parts In-Stock

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3,118

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Corphita

USA . 674 parts In-Stock

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674

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Parana Technologies

USA . 412 parts In-Stock

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$1.126

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412

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$1.126

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Overview

Elevate your audio experience with the TS487-1IQT from STMicroelectronics, a powerhouse in precision and performance. Designed for audio and video applications, this ultra-thin amplifier delivers exceptional sound quality while fitting seamlessly into compact designs. With its wide operating temperature range and robust stability, it's perfect for industrial environments. Benefit from STMicroelectronics' legacy of innovation and reliability—choose the TS487-1IQT to unlock unparalleled audio clarity!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic devices, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square shape offers a uniform footprint, facilitating efficient PCB layout and saving space in the overall design.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed to enhance audio signals, ensuring high-quality sound reproduction.

Power Supplies (V): 2.5/5.5

A wide power supply range of 2.5 to 5.5V allows for flexibility in various power supply systems, enhancing compatibility with diverse applications.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connections for a robust circuit design, supporting more complex configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is optimized for thermal performance and minimal height, allowing for efficient heat dissipation in tight spaces.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and stability in various operating environments, suitable for industrial use.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this product suitable for rugged applications and extreme conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and enhances the overall durability of the connections, leading to reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning can optimize layout and provide flexibility in connections, making for easier integration into various designs.

Nominal Output Power: 0.108 W

The nominal output power is suitable for driving small speakers, making it ideal for portable audio equipment.

Maximum Seated Height: 1 mm

A very low seated height is advantageous for ultra-slim designs and compact assemblies, ensuring adaptability to modern electronics.

Width: 3 mm

The compact width enables dense packing of components on PCBs, facilitating the design of smaller devices.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate down to 2V ensures compatibility with low-voltage power supplies commonly found in battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds allows for effective soldering without damaging the IC, ensuring robust assembly.

Peak Reflow Temperature: 260 °C

The peak reflow temperature matches industry standards, ensuring compatibility with common soldering processes and practices.

Length: 3 mm

The compact length aids in fitting into small form factor devices without compromising functionality.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this amplifier is built to withstand harsh conditions, providing reliability for professional applications.

No. of Channels: 2

Having two channels allows for stereo output, making it perfect for audio applications that require multi-channel sound.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz caters to a wide range of audio frequencies, ensuring comprehensive sound reproduction capabilities.

Terminal Form: NO LEAD

No-lead terminals contribute to a compact design and minimize space consumption on the PCB while ensuring effective performance.

Maximum Supply Current: 8 mA

A low maximum supply current of 8 mA contributes to energy efficiency, particularly important in battery-operated devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is advantageous for high-density applications, allowing for closer placement of components on the PCB.

Gain: 0 dB

With a gain of 0 dB, this amplifier is capable of buffering signals without amplifying noise, maintaining the integrity of audio signals.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5V supply voltage allows for versatility in high-performance applications, making it suitable for various use cases.

Technical Specifications

Audio & Video Amplifiers TS487-1IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

0 dB

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.108 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TS487-1IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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