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TS3704IN

STMicroelectronics

TS3704IN by STMicroelectronics

TS3704IN by STMicroelectronics is a CMOS comparator with a max input offset voltage of 6.5 mV and operates at a nominal voltage of 3V. It features four functions in an automotive-grade package, suitable for precision applications. With a wide temp range (-40 °C to 125°C), it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,015 parts In-Stock

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4,015

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Digiode

USA . 3,549 parts In-Stock

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3,549

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Q Components

USA . 1,000 parts In-Stock

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1,000

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Anansix

USA . 588 parts In-Stock

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588

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ECAB

Sweden . 40 parts In-Stock

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40

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,045 parts In-Stock

1+ parts

$1.389

100+ parts

-

1k+ parts

$1.250

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1,045

$1.389

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$1.250

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MKK Technologies

India . 1,065 parts In-Stock

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$2.612

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1,065

$2.612

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DigiPath Technology Company

USA . 1,065 parts In-Stock

1+ parts

$2.612

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1,065

$2.612

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AZTECH Wire

Italy . 1,173 parts In-Stock

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$18.420

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$18.420

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QUARKTWIN TECHNOLOGY LTD

USA . 11,502 parts In-Stock

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Vigor

Singapore . 8,936 parts In-Stock

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Corphita

USA . 4,193 parts In-Stock

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Microchip USA

USA . 4,049 parts In-Stock

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Kepictronics

USA . 1,380 parts In-Stock

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Parana Technologies

USA . 764 parts In-Stock

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$1.661

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764

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$1.661

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Overview

Elevate your designs with the TS3704IN from STMicroelectronics, where innovation meets reliability. This premium comparator excels in precision and efficiency, perfect for automotive applications and beyond. With its low power consumption and robust temperature tolerance, it ensures exceptional performance even in demanding environments. Trust STMicroelectronics' commitment to quality and experience, and unlock unmatched value for your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

A low maximum input offset voltage ensures high accuracy and precision, ideal for applications demanding reliable performance.

Maximum Average Bias Current (IIB): 0.0006 uA

This low bias current minimizes power consumption, making it energy-efficient, especially for battery-powered devices.

No. of Functions: 4

The capability to perform multiple functions allows for increased versatility in circuit design and application usage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making layout design more flexible.

Nominal Supply Voltage / Vsup: 3 V

Operating at a low nominal supply voltage contributes to lower power requirements, suitable for mobile and portable applications.

Power Supplies (V): 5

Compatibility with standard power supplies ensures easy integration into existing systems without the need for specialized equipment.

No. of Terminals: 14

The availability of multiple terminals enhances connectivity options, facilitating integration into a variety of circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies alignment and soldering, improving assembly efficiency in high-volume manufacturing.

Maximum Supply Voltage Limit: 18 V

A high supply voltage limit allows for flexibility in application use, accommodating a wide range of input voltages.

Maximum Operating Temperature: 125 °C

Withstand high temperatures makes it suitable for automotive and industrial applications where heat dissipation is a concern.

Maximum Bias Current (IIB) @ 25 °C: 0.0006 uA

Consistent low bias current at operational temperature ensures reliable performance and low drift characteristics.

Output Type: PUSH-PULL

A push-pull output configuration provides strong drive capability, allowing for faster response times in switching applications.

Nominal Response Time: 1200 ns

Fast response time is critical for high-speed applications, enabling the comparator to function effectively in dynamic environments.

Minimum Operating Temperature: -40 °C

The ability to operate at sub-zero temperatures expands application possibilities in cold environments like automotive and outdoor devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and ensures reliable connections, which is crucial for long-term performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in design layouts, allowing for optimized placement on PCBs.

Maximum Seated Height: 5.1 mm

A compact height allows for efficient space usage in tight layouts, making it suitable for small form factor applications.

Width: 7.62 mm

The width of the component supports standard PCB design practices, ensuring compatibility with existing designs.

Length: 20 mm

An optimal length provides a balance between robustness and space efficiency, allowing for easier incorporation into various designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade components meet stringent reliability and durability requirements, ensuring performance in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this comparator suitable for sensitive applications.

Terminal Form: THROUGH-HOLE

Through-hole design improves mechanical stability and reliability in high-vibration applications, making it ideal for robust installations.

Amplifier Type: COMPARATOR

As a comparator, it is designed for rapidly changing signals, making it suitable for applications requiring fast decision-making.

Maximum Supply Current: 0.1 mA

The low maximum supply current contributes to overall energy efficiency, which is vital for battery-dependent applications.

Terminal Pitch: 2.54 mm

A standard terminal pitch allows for compatibility with typical PCB layouts and component placement tools, simplifying design and assembly.

Technical Specifications

Comparators TS3704IN attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

600 pA

Operational Characteristics

Maximum Supply Current:

100 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.2 µs

Physical Characteristics

Length:

0.787 in (20 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.201 in (5.1 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TS3704IN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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