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TS3702IYDT

STMicroelectronics

TS3702IYDT by STMicroelectronics

STMicroelectronics' TS3702IYDT is a dual-function comparator with 6500uV max input offset voltage and 0.0006uA max average bias current. Ideal for automotive applications, it operates b/w -40 to 125 °C with push-pull output type. Package style is small outline, suitable for surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,509 parts In-Stock

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4,509

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Digiode

USA . 3,679 parts In-Stock

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3,679

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Anansix

USA . 2,114 parts In-Stock

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2,114

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 871 parts In-Stock

1+ parts

$4.567

100+ parts

-

1k+ parts

$4.110

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871

$4.567

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$4.110

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MKK Technologies

India . 767 parts In-Stock

1+ parts

$8.588

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767

$8.588

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DigiPath Technology Company

USA . 767 parts In-Stock

1+ parts

$8.588

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767

$8.588

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Corphita

USA . 3,925 parts In-Stock

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3,925

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Parana Technologies

USA . 1,274 parts In-Stock

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$5.460

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1,274

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$5.460

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Overview

Enhance the performance of your automotive applications with the STMicroelectronics TS3702IYDT comparator. Crafted by a trusted manufacturer known for superior quality, this small outline device offers precision and reliability in a compact package. With a fast response time and low power consumption, this comparator is perfect for a wide range of automotive electronics, ensuring optimal functionality and efficiency. Upgrade your designs with the value and benefits that the TS3702IYDT brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

High maximum input offset voltage allows for accurate comparison of input signals, ensuring precision in the output.

Maximum Average Bias Current (IIB): 0.0006 uA

Low bias current helps in reducing power consumption and ensures minimal impact on the input signal.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into circuit boards, saving space and enabling efficient assembly.

No. of Functions: 2

Having multiple functions in a single component enhances functionality and reduces the need for additional components in the circuit design.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and soldering on circuit boards, enhancing the overall manufacturability of the product.

Nominal Supply Voltage / Vsup (V): 3

Stable nominal supply voltage of 3V ensures consistent performance in different operating conditions.

Power Supplies (V): +-1.35/+-8/2.7/16

Wide range of power supply options gives flexibility in designing circuits and enables compatibility with different voltage requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function reliably in demanding environments without overheating.

Output Type: PUSH-PULL

Push-pull output configuration provides strong signal amplification and can drive external loads effectively.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for various applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in automotive applications.

Technical Specifications

Comparators TS3702IYDT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

50 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS3702IYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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