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TS3702IP

STMicroelectronics

TS3702IP by STMicroelectronics

TS3702IP by STMicroelectronics is a dual comparator in a compact 8-terminal package, ideal for automotive applications. It features a max input offset voltage of 6.5 mV, operates at supply voltages up to 18 V, and has a response time of 1500 ns. Its robust design ensures reliable performance across -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,878 parts In-Stock

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2,878

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Anansix

USA . 1,052 parts In-Stock

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1,052

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Vyrian

USA . 921 parts In-Stock

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921

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$1.573

100+ parts

-

1k+ parts

$1.416

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786

$1.573

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$1.416

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MKK Technologies

India . 2,240 parts In-Stock

1+ parts

$2.958

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2,240

$2.958

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$2.958

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2,240

$2.958

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Corphita

USA . 2,616 parts In-Stock

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2,616

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Parana Technologies

USA . 659 parts In-Stock

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$1.881

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659

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$1.881

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Overview

Elevate your designs with the TS3702IP from STMicroelectronics, a benchmark in comparator technology. Built for precision and reliability, this robust component excels in automotive applications, ensuring top performance even in extreme conditions. With its low power consumption and compact design, it seamlessly integrates into various systems. Trust in STMicroelectronics' legacy of quality and innovation to empower your projects and enhance efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliable performance in various environments.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage contributes to high accuracy and precision in comparisons.

Maximum Average Bias Current (IIB): 0.0006 uA

Ensures minimal power consumption and improved battery life for portable applications.

Surface Mount: YES

Supports modern assembly techniques, allowing for compact designs and efficient manufacturing.

No. of Functions: 2

Provides design flexibility, allowing for multiple functionalities in a single component.

Package Shape: RECTANGULAR

Optimizes space utilization on PCBs, making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3

Compatible with standard low-voltage systems, making it ideal for battery-operated devices.

Power Supplies (V): +-1.5/+-8/3/16

Versatile power supply range enhances usability across different applications.

No. of Terminals: 8

Provides sufficient connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Facilitates high-density mounting on printed circuit boards, saving space.

Maximum Supply Voltage Limit: 18 V

Allows for greater flexibility in design, supporting a wider range of applications.

Maximum Operating Temperature: 125 °C

High-temperature rating makes it suitable for use in harsh environments, ensuring reliability.

Output Type: PUSH-PULL

Provides strong output drive capabilities, enabling better integration with various loads.

Nominal Response Time: 1500 ns

Sufficiently fast response time supports high-speed applications without lag.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures performance under extreme conditions.

Terminal Finish: TIN LEAD

Ensures good solderability and long-term reliability of connections.

Terminal Position: DUAL

Facilitates a variety of layout orientations, enhancing design flexibility.

Maximum Seated Height: 1.2 mm

Low profile design contributes to thinner electronic devices, improving aesthetics and portability.

Width: 3 mm

Compact width allows for integration in tight spaces within electronic assemblies.

Length: 4.4 mm

Short length further supports small form-factor applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and safety in vehicles.

Maximum Negative Supply Voltage Limit: 0 V

Safe operational limits prevent damage and enhance longevity of the device.

Technology: CMOS

CMOS technology offers high integration, low power consumption, and better performance.

Terminal Form: GULL WING

Gull wing leads support easy soldering on PCBs, simplifying assembly processes.

Amplifier Type: COMPARATOR

Ideal for applications that require precise voltage comparison and fast responses.

Maximum Supply Current: 0.05 mA

Very low supply current enhances energy efficiency, making it suitable for low-power applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Eases design constraints as it allows for single-supply operation in circuits.

Terminal Pitch: 0.65 mm

Narrow terminal pitch provides additional design flexibility for circuit routing.

Technical Specifications

Comparators TS3702IP attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.5/±8/3/16 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

50 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TS3702IP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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