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TS3702CD

STMicroelectronics

TS3702CD by STMicroelectronics

TS3702CD by STMicroelectronics is a dual comparator in a compact SO package, ideal for low-power applications. It features a max input offset voltage of 6.5 mV, operates at supply voltages up to ±16 V, and has a nominal response time of 1500 ns. This device is perfect for precision signal processing in commercial environments.

Median Price

$0.603

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,970 parts In-Stock

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Digiode

USA . 2,797 parts In-Stock

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Anansix

USA . 2,044 parts In-Stock

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Lakeland Logistics Inc

USA . 1,000 parts In-Stock

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1,000

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Bristol Electronics

USA . 1,000 parts In-Stock

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$0.603

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$0.418

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1,000

-

$0.603

$0.418

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LIBRA Elektronik GmbH

Germany . 47 parts In-Stock

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Donberg Electronics Ltd

Ireland . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 421 parts In-Stock

1+ parts

$2.960

100+ parts

-

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$2.664

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-

421

$2.960

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$2.664

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Microchip USA

USA . 143 parts In-Stock

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$3.909

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MKK Technologies

India . 1,392 parts In-Stock

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$5.565

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$5.565

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DigiPath Technology Company

USA . 1,392 parts In-Stock

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$5.565

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$5.565

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AZTECH Wire

Italy . 277 parts In-Stock

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$13.520

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Kepictronics

USA . 111,500 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Assy Fe

Spain . 5,775 parts In-Stock

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Perfect Parts

USA . 3,208 parts In-Stock

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Corphita

USA . 3,145 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,519 parts In-Stock

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$3.539

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$3.539

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Cyclops Electronics Ltd (Excess)

UK . 1,432 parts In-Stock

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1,432

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Overview

Elevate your designs with the TS3702CD from STMicroelectronics, a benchmark in comparator technology. Renowned for its reliability and precision, this dual-function device delivers unmatched performance across diverse applications, from industrial automation to consumer electronics. With ultra-low power consumption and robust temperature stability, the TS3702CD ensures your projects are both efficient and durable. Trust in STMicroelectronics’ legacy of excellence—choose the TS3702CD for quality that drives innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy allows for a lightweight product that is resistant to environmental factors, enhancing durability.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage ensures high accuracy in signal processing, making this comparator suitable for precision applications.

Maximum Average Bias Current (IIB): 0.0006 uA

Minimal bias current contributes to lower power consumption, making it ideal for battery-operated devices.

Surface Mount: YES

Surface mount technology allows for smaller board designs and more efficient manufacturing processes.

No. of Functions: 2

With two functions integrated, this product offers versatility, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape allows for better space utilization on PCBs, accommodating compact designs.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V makes this comparator compatible with low-voltage systems, enhancing its usability in modern electronics.

Power Supplies (V): ±1.35/±8/2.7/16

The broad range of supported power supplies provides flexibility for various applications, enabling compatibility with different circuit designs.

No. of Terminals: 8

Eight terminals allow for a robust connection setup, ensuring reliable performance in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for high density in electronic designs.

Maximum Supply Voltage Limit: 18 V

A maximum supply voltage limit of 18V provides safety in varied operational environments, preventing damage due to voltage spikes.

Maximum Operating Temperature: 70 °C

With a high operating temperature limit, this comparator is suitable for use in demanding environments, ensuring reliability.

Output Type: PUSH-PULL

The push-pull output configuration allows for efficient driving of loads, making it effective in a variety of application circuits.

Nominal Response Time: 1500 ns

A nominal response time of 1500 ns indicates quick reaction to input changes, making this comparator suitable for high-speed applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures functionality in a wide range of environments, including low-temperature settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout options on PCBs, facilitating easier integration into various designs.

Maximum Seated Height: 1.75 mm

A low seated height assists in maintaining a slim profile for low-profile applications, enhancing design aesthetics.

Width: 3.9 mm

The compact width of 3.9 mm facilitates use in space-constrained electronic designs requiring miniaturization.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow temperature of 30 seconds provides assurance that the component can withstand modern manufacturing processes without compromising integrity.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures compatibility with standard soldering methods, simplifying the manufacturing process.

Length: 4.9 mm

The short length of 4.9 mm contributes to compact designs, making it suitable for small electronics like handheld devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures the product is suitable for a wide range of general-purpose applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-powered and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide stable connections, enhancing reliability in assembly.

Amplifier Type: COMPARATOR

Designed as a comparator, this product delivers precision voltage comparisons, crucial in signal processing and decision-making circuits.

Maximum Supply Current: 0.05 mA

Low supply current requirements contribute to energy efficiency, further extending battery life in portable devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a balance between compactness and ease of manual soldering, improving assembly options.

Technical Specifications

Comparators TS3702CD attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

50 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS3702CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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