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TS3702MP

STMicroelectronics

TS3702MP by STMicroelectronics

TS3702MP from STMicroelectronics is a dual comparator with a max input offset voltage of 6.5 mV and operates at supply voltages up to ±18 V. It features low bias current (0.6 nA) and a fast response time of 1500 ns, ideal for military applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,488 parts In-Stock

1+ parts

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1,488

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Anansix

USA . 910 parts In-Stock

1+ parts

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910

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Vyrian

USA . 365 parts In-Stock

1+ parts

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365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 37 parts In-Stock

1+ parts

$3.362

100+ parts

-

1k+ parts

$3.026

10k+ parts

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37

$3.362

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$3.026

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MKK Technologies

India . 2,371 parts In-Stock

1+ parts

$6.321

100+ parts

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2,371

$6.321

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DigiPath Technology Company

USA . 2,371 parts In-Stock

1+ parts

$6.321

100+ parts

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2,371

$6.321

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Corphita

USA . 2,689 parts In-Stock

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2,689

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Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

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100+ parts

$4.019

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1,769

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$4.019

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Overview

Elevate your designs with the TS3702MP comparator from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, high-performance device boasts ultra-low bias current and exceptional input offset voltage, ensuring precision and reliability in critical applications. Ideal for military and industrial uses, its robust design withstands extreme conditions. Trust STMicroelectronics for unparalleled quality and efficiency, empowering your projects to excel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and is suitable for a range of ambient conditions.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage enhances precision in signal comparison, making it suitable for high-accuracy applications.

Maximum Average Bias Current (IIB): 0.0006 uA

Minimal bias current reduces error and increases the reliability of the signal being analyzed.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly processes in modern electronics.

No. of Functions: 2

Having multiple functions increases versatility, making it adaptable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, allowing for efficient use of board real estate.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is widely compatible with various electronic systems, simplifying integration.

Power Supplies (V): ±2/±8/4/16

Flexible power supply options provide greater adaptability to meet specific system requirements.

No. of Terminals: 8

An 8-terminal configuration allows for multiple connections, ensuring flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim profile aids in space-constrained applications, making it ideal for compact electronic devices.

Maximum Supply Voltage Limit: 18 V

High supply voltage limit enables use in diverse applications without risking damage to the component.

Maximum Operating Temperature: 125 °C

A generous temperature range ensures reliable performance in high-temperature environments typically found in industrial applications.

Output Type: PUSH-PULL

Push-pull output type increases the efficiency and speed of signal transmission in circuits.

Nominal Response Time: 1500 ns

A fast response time is essential for applications requiring real-time signal processing.

Minimum Operating Temperature: -55 °C

Ability to operate at extreme cold temperatures makes it suitable for military and aerospace applications.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and provides better connectivity in assemblies.

Terminal Position: DUAL

Dual terminal position optimizes layout and connectivity options on circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for thin-profile designs, making it more suitable for space-sensitive projects.

Width: 3 mm

Compact width allows this comparator to fit into tight layouts, expanding design possibilities.

Length: 4.4 mm

Short length contributes to a compact footprint, benefiting miniaturized electronic devices.

Temperature Grade: MILITARY

Military-grade components provide enhanced reliability and performance under extreme conditions, ideal for defense applications.

Maximum Negative Supply Voltage Limit: 0 V

Zero negative voltage limit simplifies design and prevents potential issues in signal grounding.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical strength and ensure better soldering quality.

Amplifier Type: COMPARATOR

As a comparator, it provides precision signal comparison essential for various sensing applications.

Maximum Supply Current: 0.05 mA

Low supply current consumption is crucial for power-sensitive applications, extending battery life.

Nominal Negative Supply Voltage (Vsup): 0 V

Operating with a nominal negative voltage of 0V supports simple designs and straightforward integration.

Terminal Pitch: 0.65 mm

A standardized terminal pitch facilitates easier machine assembly and compatibility with other components.

Technical Specifications

Comparators TS3702MP attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±2/±8/4/16 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

50 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TS3702MP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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