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TL331IDBVTE4

Texas Instruments

TL331IDBVTE4 by Texas Instruments

TL331IDBVTE4 by Texas Instruments is a comparator with 9000uV max input offset voltage, -0.4uA max average bias current, and 1300ns nominal response time. Ideal for industrial applications requiring open-collector output type and operating temperatures from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,518 parts In-Stock

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Digiode

USA . 3,297 parts In-Stock

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3,297

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Nova Conductors

Japan . 16 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 957 parts In-Stock

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$2.633

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957

$2.633

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Semicontronic

India . 1,525 parts In-Stock

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$3.410

100+ parts

$3.325

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$3.308

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$3.410

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$3.308

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$6.240

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$5.928

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$5.928

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$6.240

$5.928

$5.928

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Ampacity Inc.

Singapore . 512 parts In-Stock

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$6.410

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512

$6.410

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Parana Technologies

USA . 1,151 parts In-Stock

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$6.537

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$7.279

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$6.537

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$7.279

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DigiPath Technology Company

USA . 1,940 parts In-Stock

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$7.198

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$7.198

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ChromeModa Solutions

Germany . 2,684 parts In-Stock

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$7.345

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$6.023

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$7.345

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IDEA Electronic Components Group

UK . 2,126 parts In-Stock

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$7.345

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$6.610

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One Stop Electronics

USA . 1,323 parts In-Stock

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$7.410

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AZTECH Wire

Italy . 850 parts In-Stock

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$18.749

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$18.749

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Argo Parts USA

USA . 4,660 parts In-Stock

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Continental Prestige Electronics

USA . 4,572 parts In-Stock

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Corphita

USA . 3,822 parts In-Stock

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Microchip USA

USA . 199 parts In-Stock

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199

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Bastille Electronics

Australia . 73 parts In-Stock

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73

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Overview

Enhance your electronic designs with the TL331IDBVTE4 from Texas Instruments, a top-quality comparator that delivers precision and reliability. Manufactured by industry leader Texas Instruments, this comparator is ideal for a variety of applications, offering unmatched performance and durability. Experience the benefits of fast response times, low power consumption, and a wide supply voltage range. Trust in Texas Instruments for cutting-edge technology that exceeds expectations. Elevate your projects with the TL331IDBVTE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the comparator, making it suitable for various operating environments.

Maximum Input Offset Voltage: 9000 uV

The low input offset voltage ensures accurate comparison of input signals, resulting in reliable performance of the comparator.

Surface Mount: YES

Being surface mountable makes it easy to integrate this comparator onto PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage makes it compatible with standard power sources, making it easy to incorporate into a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this comparator can function reliably even in high-temperature environments.

Technical Specifications

Comparators TL331IDBVTE4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5/30 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

-400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

700 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TL331IDBVTE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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