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TL331CP

Texas Instruments

TL331CP by Texas Instruments

TL331CP by Texas Instruments is a bipolar technology comparator with a max input offset voltage of 9000 uV and a max average bias current of -0.4 uA. It operates at temperatures ranging from 0 to 70 °C and has an open-collector output type, making it suitable for applications requiring precise voltage comparisons in commercial-grade environments.

Median Price

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Lifecycle Status

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12

In-Stock Inventory

1k+

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Vyrian

USA . 4,586 parts In-Stock

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Digiode

USA . 2,803 parts In-Stock

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ComSIT Distribution GmbH

Germany . 521 parts In-Stock

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ABC Electronics Ltd.

UK . 73 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 43 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 42 parts In-Stock

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Lakeview Electronics

USA . 23 parts In-Stock

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ECAB

Sweden . 18 parts In-Stock

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MISTER SPROCKETS

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LittleDiode

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GES GmbH

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Ampacity Inc.

Singapore . 869 parts In-Stock

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$1.410

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Parana Technologies

USA . 1,163 parts In-Stock

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DigiPath Technology Company

USA . 552 parts In-Stock

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$4.439

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$4.084

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ChromeModa Solutions

Germany . 2,331 parts In-Stock

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$4.530

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$3.715

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

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$4.077

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AZTECH Wire

Italy . 848 parts In-Stock

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One Stop Electronics

USA . 1,297 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,525 parts In-Stock

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Corphita

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Assy Fe

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Overview

Discover the reliability and precision of the TL331CP Comparator by Texas Instruments, a trusted name in electronic components. This versatile device is perfect for a wide range of applications, delivering fast response times and low power consumption. With its open-collector output type and dual terminal position, the TL331CP offers exceptional performance in a compact package. Trust Texas Instruments to provide you with high-quality products that meet your needs, ensuring smooth operation and peace of mind. Elevate your projects with the TL331CP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the comparator.

Maximum Input Offset Voltage: 9000 uV

With a high maximum input offset voltage, this comparator can maintain accuracy even with small input signal differences.

Maximum Average Bias Current (IIB): -0.4 uA

The low maximum average bias current minimizes the impact of internal current flow on the comparator's performance, ensuring reliable operation.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage makes this comparator suitable for a wide range of applications where a standard voltage is required.

Output Type: OPEN-COLLECTOR

The open-collector output type allows for easy interfacing with other circuitry, making this comparator versatile in various design applications.

Nominal Response Time: 1300 ns

With a fast nominal response time of 1300 ns, this comparator can quickly react to input signal changes, making it ideal for real-time applications.

Technology: BIPOLAR

The bipolar technology used in this comparator offers high accuracy and low noise, ensuring reliable performance in precision measurement applications.

Technical Specifications

Comparators TL331CP attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5/30 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

-400 nA

Operational Characteristics

Maximum Supply Current:

800 μA

Nominal Supply Voltage:

5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Length:

0.386 in (9.81 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TL331CP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-267-2294, 5962012672294

NIIN

012672294

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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