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TL331IDBVRE4

Texas Instruments

TL331IDBVRE4 by Texas Instruments

TL331IDBVRE4 by Texas Instruments is a comparator with a max input offset voltage of 9000 uV and a max average bias current of -0.4 uA. It is used in industrial applications where precise voltage comparisons are required.

Median Price

$0.253

Lifecycle Status

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Mouser Electronics

USA . 16,868 parts In-Stock

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Nova Conductors

Japan . 96 parts In-Stock

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$0.323

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Vyrian

USA . 16,768 parts In-Stock

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Digiode

USA . 1,241 parts In-Stock

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Speed Components Ltd

Israel . 86 parts In-Stock

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Connector Distribution Corp

USA . 74 parts In-Stock

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Right Parts Inc.

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Semicontronic

India . 16,570 parts In-Stock

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$0.215

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$0.210

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$0.209

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Continental Prestige Electronics

USA . 6,391 parts In-Stock

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$0.323

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$0.317

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Netroflash

USA . 2,000 parts In-Stock

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$0.323

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Argo Parts USA

USA . 280 parts In-Stock

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$0.323

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$0.313

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Modulus Dynamics

Lithuania . 62 parts In-Stock

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$0.359

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$0.355

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$0.344

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62

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Ampacity Inc.

Singapore . 16,812 parts In-Stock

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$0.468

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Component Stockers USA

USA . 23,591 parts In-Stock

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$0.740

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$0.500

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$0.310

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Corohmni

South Africa . 758 parts In-Stock

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$2.301

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$4.062

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$3.859

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$3.859

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$4.062

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Parana Technologies

USA . 31 parts In-Stock

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$5.233

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$485.982

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$4.710

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DigiPath Technology Company

USA . 1,225 parts In-Stock

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$5.762

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ChromeModa Solutions

Germany . 4,229 parts In-Stock

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$5.880

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IDEA Electronic Components Group

UK . 840 parts In-Stock

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$5.880

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Perfect Parts

USA . 520,503 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corphita

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Microchip USA

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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Overview

Discover the TL331IDBVRE4, a high-quality comparator by Texas Instruments that offers unparalleled value and benefits. With its advanced technology and precise performance, this product guarantees reliable and accurate results for various applications. Whether you need it for voltage monitoring, level shifting, or signal conditioning, the TL331IDBVRE4 delivers outstanding performance in a compact package. Trust in Texas Instruments' expertise and experience in manufacturing, and unlock the potential of your projects with this exceptional comparator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Input Offset Voltage: 9000 uV

High input offset voltage allows for accurate comparison between input signals, making this comparator suitable for precise measurements.

Maximum Average Bias Current (IIB): -0.4 uA

Low bias current ensures minimal interference with input signals, leading to accurate and reliable output results.

Surface Mount: YES

Surface mount option enables easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape facilitates compact design and efficient placement within electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, making it compatible with a wide range of applications.

Power Supplies (V): 5/30

Supports a range of power supply voltages, offering flexibility in usage scenarios.

No. of Terminals: 5

Compact design with a minimal number of terminals simplifies circuit connections and layout.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package design with low profile and shrink pitch allows for space-efficient mounting on PCBs.

Maximum Supply Voltage Limit: 36 V

Wide supply voltage range ensures compatibility with various power sources and protection against overvoltage conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in harsh environmental conditions.

Maximum Bias Current (IIB) @25°C: 0.25 uA

Low bias current at standard temperature ensures stable and accurate output responses.

Output Type: OPEN-COLLECTOR

Open-collector output configuration provides flexibility in connecting external components for different applications.

Nominal Response Time: 1300 ns

Fast response time allows for quick signal processing, suitable for applications requiring rapid decision-making.

Minimum Operating Temperature: -40 °C

Wide temperature range operation enables functionality in cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable electrical connections and corrosion resistance for extended product life.

Terminal Position: DUAL

Dual terminal position enhances stability during installation and prevents signal interference for accurate comparisons.

Maximum Seated Height: 1.45 mm

Low profile design with minimum seated height allows for compact integration in space-constrained applications.

Width: 1.6 mm

Narrow width design enables dense packing on circuit boards, optimizing space utilization in electronic devices.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures reliable soldering during assembly processes.

Length: 2.9 mm

Compact length dimension facilitates efficient placement and routing of signals within electronic circuits.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in rugged operating environments.

Technology: BIPOLAR

Bipolar technology offers superior accuracy and stability in signal comparison applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure attachment to circuit boards and facilitates automated assembly processes.

Amplifier Type: COMPARATOR

Comparator amplifier type allows for precise comparison of input signals, making it suitable for voltage measurement applications.

Maximum Supply Current: 0.7 mA

Low supply current consumption ensures efficient power usage and minimal heat generation during operation.

Packing Method: TR

Tape and reel packing method facilitates automated pick-and-place assembly and protects components during shipping and storage.

Terminal Pitch: 0.95 mm

Optimal terminal pitch spacing simplifies board layout and facilitates soldering for reliable electrical connections.

Technical Specifications

Comparators TL331IDBVRE4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5/30 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

-400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

700 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

1.3 µs

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TL331IDBVRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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