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TS27M2ACDT

STMicroelectronics

TS27M2ACDT by STMicroelectronics

TS27M2ACDT from STMicroelectronics is a micropower operational amplifier featuring a max input offset voltage of 6500 µV and a nominal voltage of 10 V. With an impressive common mode reject ratio of 80 dB, it’s ideal for precision applications. Its compact design and low bias current make it suitable for battery-powered devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,276 parts In-Stock

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10,276

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Digiode

USA . 4,816 parts In-Stock

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4,816

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Pegasus Components GmbH

Germany . 2,500 parts In-Stock

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2,500

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Anansix

USA . 2,312 parts In-Stock

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2,312

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IDEA Electronic Components Group

UK . 1,203 parts In-Stock

1+ parts

$3.056

100+ parts

-

1k+ parts

$2.751

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1,203

$3.056

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$2.751

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Microchip USA

USA . 473 parts In-Stock

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$5.131

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473

$5.131

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MKK Technologies

India . 517 parts In-Stock

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$5.747

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517

$5.747

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DigiPath Technology Company

USA . 517 parts In-Stock

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$5.747

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517

$5.747

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AZTECH Wire

Italy . 304 parts In-Stock

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$9.550

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$9.550

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Component Stockers USA

USA . 710 parts In-Stock

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$99.990

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710

$99.990

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Vigor

Singapore . 5,000 parts In-Stock

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Corphita

USA . 4,932 parts In-Stock

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Perfect Parts

USA . 2,682 parts In-Stock

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Parana Technologies

USA . 1,485 parts In-Stock

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$3.654

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Overview

Unlock unparalleled performance with the TS27M2ACDT operational amplifier from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for precision and reliability, this micropower device excels in diverse applications across consumer electronics, automation, and more. Experience exceptional input offset voltage and outstanding common mode rejection, ensuring your designs achieve optimal efficiency and accuracy. Trust STMicroelectronics for quality that empowers your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures a reliable and long-lasting product, suitable for various applications.

Maximum Input Offset Voltage: 6500 µV

This low offset voltage allows for accurate signal processing, making it ideal for precision applications.

Maximum Average Bias Current (IIB): 0.00015 µA

The extremely low bias current minimizes power consumption and increases efficiency, especially in battery-powered devices.

Surface Mount: YES

Being surface mount compatible allows for easy integration into compact electronic circuits, enhancing design flexibility.

No. of Functions: 2

Dual functionality provides more value and versatility, making it suitable for various circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is standardized for easy placement and maximizes layout efficiency on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR improves performance in noisy environments by effectively rejecting common-mode signals.

Nominal Supply Voltage / Vsup (V): 10

A nominal voltage supply of 10V allows for convenient interfacing with standard power supplies.

Power Supplies (V): 5/10

Compatible with both 5V and 10V supplies, making it flexible for various applications and designs.

No. of Terminals: 8

The 8-terminal configuration supports a wide range of circuit functionalities while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained designs, allowing for compact and efficient layouts.

Maximum Supply Voltage Limit: 18 V

This high voltage limit provides flexibility in high-power applications without risking damage.

Maximum Operating Temperature: 70 °C

With a high temperature limit, this OP amp is suitable for operation in demanding environments.

Frequency Compensation: YES

Built-in frequency compensation enhances stability, especially in feedback configurations.

Minimum Voltage Gain: 20000

A high voltage gain ensures significant amplification of input signals, making it suitable for weak signal applications.

Minimum Operating Temperature: 0 °C

The operational range starting from 0 °C ensures reliability in moderate temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures good connectivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning enhances layout options, providing additional flexibility for designers.

Maximum Seated Height: 1.75 mm

A low seated height helps maintain a minimal profile in compact designs.

Width: 3.9 mm

The narrow width is advantageous in high-density PCB designs, enabling efficient space utilization.

Micropower: YES

Micropower capabilities ensure minimal energy consumption, making it suitable for low-power applications.

Maximum Time At Peak Reflow Temperature: 30 s

Extended time at peak reflow allows for reliable soldering without thermal damage to sensitive components.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capacity supports modern manufacturing processes with lead-free solder.

Length: 4.9 mm

Compact length helps in minimizing the overall footprint of the circuit design.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability in everyday use.

Low-Bias: YES

Low-bias characteristics allow for optimal performance in precision and critical applications.

Maximum Negative Supply Voltage Limit: 0 V

The 0V limit on negative supply voltage simplifies power supply designs and enhances safety.

Nominal Negative Supply Voltage (Vsup): 0 V

Compatibility with a 0V negative supply voltage expands application potential in various circuit configurations.

Nominal Unity Gain Bandwidth: 1000 kHz

High unity gain bandwidth makes this operational amplifier suitable for a variety of high-frequency applications.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, beneficial for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, enhancing reliability in production and assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

This operational amplifier type is versatile and commonly used in countless electronic applications.

Maximum Supply Current: 0.25 mA

Low supply current significantly reduces power consumption, especially important for battery-operated devices.

Nominal Slow Rate: 0.6 V/µs

A decent slow rate allows for controlled response, making this OP amp suitable for slower signal applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy compatibility with industry-standard PCB layouts.

Packing Method: TAPE AND REEL

Tape and reel packaging ensures efficient handling and assembly in automated production lines.

Technical Specifications

Operational Amplifiers (Op Amps) TS27M2ACDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

20000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

150 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

250 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS27M2ACDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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