Loading...

TS271BMDT

STMicroelectronics

TS271BMDT by STMicroelectronics

TS271BMDT by STMicroelectronics is a CMOS operational amplifier with a max input offset voltage of 3500 µV and a common mode reject ratio of 80 dB. It operates within -55 °C to 125°C, making it ideal for military applications. This low-bias op-amp supports programmable power and features an 8-terminal gull-wing package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,741

-

-

-

-

Digiode

USA . 4,444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,444

-

-

-

-

Anansix

USA . 2,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,391

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$5.888

100+ parts

-

1k+ parts

$5.299

10k+ parts

-

582

$5.888

-

$5.299

-

MKK Technologies

India . 2,052 parts In-Stock

1+ parts

$11.072

100+ parts

-

1k+ parts

-

10k+ parts

-

2,052

$11.072

-

-

-

DigiPath Technology Company

USA . 2,052 parts In-Stock

1+ parts

$11.072

100+ parts

-

1k+ parts

-

10k+ parts

-

2,052

$11.072

-

-

-

Corphita

USA . 2,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,197

-

-

-

-

Parana Technologies

USA . 153 parts In-Stock

1+ parts

-

100+ parts

$7.040

1k+ parts

-

10k+ parts

-

153

-

$7.040

-

-

Overview

Elevate your designs with the TS271BMDT from STMicroelectronics, a premier operational amplifier that combines exceptional reliability and performance. Crafted with precision in military-grade technology, this versatile op-amp excels in critical applications, offering superb stability and low power consumption. Experience enhanced signal quality and efficiency, making the TS271BMDT an invaluable asset for your projects, backed by STMicroelectronics' renowned commitment to innovation and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the body material ensures durability and low weight, making it suitable for various applications.

Maximum Input Offset Voltage: 3500 µV

A maximum input offset voltage of 3500 µV ensures reliable performance in precision applications.

Maximum Average Bias Current (IIB): 0.0003 µA

This low average bias current minimizes error in high-impedance applications, making it ideal for sensitive sensors.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and improved assembly processes.

Package Shape: RECTANGULAR

The rectangular package allows for easy placement on PCBs and optimizes space utilization.

Nominal Common Mode Reject Ratio: 80 dB

An 80 dB CMRR indicates excellent rejection of common mode signals, enhancing the accuracy of differential measurements.

Nominal Supply Voltage / Vsup (V): 10

A nominal supply voltage of 10V makes this Op Amp versatile for a wide range of applications.

Power Supplies (V): 10

The ability to operate at 10V power supplies allows compatibility with many existing systems.

No. of Terminals: 8

With 8 terminals, it provides multiple connection options for diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package reduces the footprint on PCBs, ideal for space-constrained applications.

Maximum Supply Voltage Limit: 18 V

The high supply voltage limit enhances adaptability in various applications, including higher-voltage circuits.

Maximum Operating Temperature: 125 °C

This high operating temperature rating guarantees reliable performance even in extreme conditions.

Frequency Compensation: YES

Frequency compensation helps maintain stability across a wide frequency range, ensuring consistent operation.

Minimum Voltage Gain: 6000

A minimum voltage gain of 6000 ensures effective amplification for low-level signals.

Minimum Operating Temperature: -55 °C

The low temperature rating makes this Op Amp suitable for harsh environments, including military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance connectivity and reliability over long-term usage.

Terminal Position: DUAL

Dual terminal positions ensure ease of integration into both new and existing designs.

Maximum Seated Height: 1.75 mm

The low seated height reduces overall device height, contributing to compact design strategies.

Width: 3.9 mm

The compact width facilitates integration into densely packed circuit layouts.

Length: 4.9 mm

The short length further aids in device miniaturization, enhancing design flexibility.

Temperature Grade: MILITARY

Military-grade temperature performance guarantees robustness under extreme conditions, essential for defense applications.

Low-Bias: YES

Low-bias characteristics make it an optimal choice for high-precision and low-power applications.

Maximum Negative Supply Voltage Limit: 0 V

The capability of operating with a maximum negative supply of 0V allows for single supply operation, simplifying designs.

Nominal Negative Supply Voltage (Vsup): 0 V

Single-supply operation minimizes component count and increases efficiency in circuit designs.

Nominal Unity Gain Bandwidth: 100 kHz

With a unity gain bandwidth of 100 kHz, this Op Amp offers good performance for a variety of signal amplification tasks.

Technology: CMOS

CMOS technology provides lower power consumption and higher integration capabilities.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhanced reliability for surface mount applications.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile and suitable for numerous analog signal processing applications.

Maximum Supply Current: 1.5 mA

Low maximum supply current ensures efficient power usage and longer battery life in portable applications.

Packing Method: TAPE AND REEL

Tape and reel packaging ensures ease of handling and automated assembly processes, streamlining production.

Programmable Power: YES

Programmable power features enhance flexibility in power management and circuit optimization.

Nominal Slow Rate: 0.04 V/µs

A nominal slow rate allows for controlled response in dynamic circuit conditions, improving stability.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for compatibility with various PCB designs, easing integration.

Technical Specifications

Operational Amplifiers (Op Amps) TS271BMDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

10 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Programmable Power:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

6000

Nominal Slew Rate:

0.04 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS271BMDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19