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TS271AIDT

STMicroelectronics

TS271AIDT by STMicroelectronics

TS271AIDT by STMicroelectronics is a low-bias operational amplifier with a max input offset voltage of 6500 µV and an 80 dB common mode reject ratio. It operates within -40 °C to 125°C, making it ideal for automotive applications. This surface-mount device features a nominal voltage of 10 V and offers programmable power capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,154 parts In-Stock

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13,154

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R&J Components

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 1,649 parts In-Stock

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1,649

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Anansix

USA . 115 parts In-Stock

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115

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IDEA Electronic Components Group

UK . 949 parts In-Stock

1+ parts

$3.471

100+ parts

-

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$3.124

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949

$3.471

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$3.124

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MKK Technologies

India . 2,263 parts In-Stock

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$6.527

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2,263

$6.527

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$6.527

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2,263

$6.527

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AZTECH Wire

Italy . 1,190 parts In-Stock

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$15.660

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1,190

$15.660

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QUARKTWIN TECHNOLOGY LTD

USA . 23,477 parts In-Stock

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23,477

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 2,316 parts In-Stock

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2,316

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,622 parts In-Stock

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$4.150

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1,622

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$4.150

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Corphita

USA . 678 parts In-Stock

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678

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Overview

Unlock precision and efficiency with the TS271AIDT operational amplifier from STMicroelectronics, a leader in semiconductor innovation. Designed for automotive applications, this compact op-amp delivers exceptional performance with ultra-low bias current and impressive common mode rejection. Experience superior reliability and versatility, ensuring your designs meet the highest standards. Elevate your projects with the quality and dependability that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

A low offset voltage ensures accurate signal amplification, making this Op Amp ideal for precision applications.

Maximum Average Bias Current (IIB): 0.0003 uA

The extremely low bias current minimizes power consumption and enhances performance in low-power applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier placement and soldering on PCBs.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR indicates excellent rejection of common-mode signals, improving performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 10

An optimal supply voltage suitable for a wide range of applications, ensuring compatibility with standard circuits.

Power Supplies (V): 10

Supports a single power supply setup, simplifying the power management in designs.

No. of Terminals: 8

The 8-terminal design allows for versatile connectivity options and integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

A small outline package allows for high-density circuit board layouts, making it ideal for compact devices.

Maximum Supply Voltage Limit: 18 V

A high supply voltage limit enables operation in a variety of applications, including those with higher voltage needs.

Maximum Operating Temperature: 125 °C

This Op Amp can operate in high-temperature environments, making it suitable for automotive and industrial applications.

Frequency Compensation: YES

Frequency compensation ensures stability across various operating conditions, enhancing reliability in signal processing.

Minimum Voltage Gain: 6000

A high minimum voltage gain allows for effective signal amplification, making this Op Amp suitable for weak signal applications.

Minimum Operating Temperature: -40 °C

A wide temperature range makes the Op Amp versatile for use in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position supports enhanced design flexibility and reduces layout complications on PCBs.

Maximum Seated Height: 1.75 mm

Low seated height enables high-density component placement, beneficial for compact designs.

Width: 3.9 mm

Compact width allows efficient use of PCB space, ideal for small form factor applications.

Length: 4.9 mm

Short length aids in reducing overall PCB footprint while maintaining performance.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and performance in vehicle applications.

Low-Bias: YES

Low-bias specifications enhance accuracy, making this Op Amp suitable for sensitive applications.

Maximum Negative Supply Voltage Limit: 0 V

The 0 V negative supply voltage simplifies operation and design for single-supply systems.

Nominal Unity Gain Bandwidth: 100 kHz

A nominal unity gain bandwidth of 100 kHz supports a wide range of signal frequencies for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, enhancing the Op Amp's efficiency and making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and accessibility in PCB assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

As a standard operational amplifier, it caters to various signal processing tasks, making it versatile in many applications.

Maximum Supply Current: 1.5 mA

Low maximum supply current ensures energy efficiency, making it ideal for portable applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Facilitates simpler power supply designs and operational setups, enhancing usability.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is ideal for linear applications, providing reliable performance for various device circuits.

Packing Method: TAPE AND REEL

The tape and reel packaging method simplifies automated assembly processes, reducing production time.

Programmable Power: YES

Programmable power features enhance design flexibility, allowing for dynamic power management.

Nominal Slow Rate: 0.04 V/us

A slow rate characteristic indicates adaptability in various applications where gradual signal changes are needed.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows compatibility with standard circuit layouts and components.

Technical Specifications

Operational Amplifiers (Op Amps) TS271AIDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

10 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Programmable Power:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

6000

Nominal Slew Rate:

0.04 V/us

Peak Bias Current:

300 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS271AIDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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