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TS27L2BCDT

STMicroelectronics

TS27L2BCDT by STMicroelectronics

TS27L2BCDT from STMicroelectronics is a dual operational amplifier featuring a max input offset voltage of 3000 µV and low bias current of 0.15 nA. It operates at supply voltages up to 18 V, making it ideal for micropower applications. Its compact SO8 package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Q Components

USA . 36,700 parts In-Stock

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36,700

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Vyrian

USA . 8,444 parts In-Stock

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8,444

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Anansix

USA . 2,417 parts In-Stock

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2,417

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Digiode

USA . 1,585 parts In-Stock

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1,585

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

1+ parts

$0.706

100+ parts

-

1k+ parts

$0.635

10k+ parts

-

1,807

$0.706

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$0.635

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MKK Technologies

India . 1,113 parts In-Stock

1+ parts

$1.327

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1,113

$1.327

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DigiPath Technology Company

USA . 1,113 parts In-Stock

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$1.327

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1,113

$1.327

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Microchip USA

USA . 488 parts In-Stock

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$4.852

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488

$4.852

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AZTECH Wire

Italy . 893 parts In-Stock

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$11.260

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893

$11.260

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Kepictronics

USA . 66,000 parts In-Stock

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66,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,101 parts In-Stock

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Corphita

USA . 2,574 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Assy Fe

Spain . 2,367 parts In-Stock

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Perfect Parts

USA . 2,213 parts In-Stock

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Parana Technologies

USA . 982 parts In-Stock

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$0.844

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982

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$0.844

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Overview

Unlock precision and reliability with the TS27L2BCDT operational amplifier from STMicroelectronics, a leader in innovative semiconductors. Crafted for exceptional performance, this low-bias, micropower op-amp excels in applications ranging from sensor processing to medical devices. With its compact design and superior common mode rejection, it delivers optimal signal integrity without compromising energy efficiency, ensuring your projects stand out. Choose STMicroelectronics for unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for diverse applications.

Maximum Input Offset Voltage: 3000 uV

A low input offset voltage is crucial for precision applications, ensuring accurate signal amplification.

Maximum Average Bias Current (IIB): 0.00015 uA

The extremely low bias current helps in minimizing the power consumption, making it ideal for battery-powered devices.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs and enhances performance by reducing lead inductance.

No. of Functions: 2

Having multiple functions enables greater versatility in circuit design, making the op-amp suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization on PCB layouts.

Nominal Common Mode Reject Ratio: 80 dB

A high common mode rejection ratio ensures that the op-amp can effectively reject common noise, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 10

A nominal supply voltage of 10V offers flexibility for various applications while maintaining performance.

Power Supplies (V): 5/10

Support for dual supply voltages accommodates a range of electronic circuits and applications.

No. of Terminals: 8

The 8 terminal configuration allows for sufficient connectivity while keeping the component compact.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB, allowing for more compact device designs.

Maximum Supply Voltage Limit: 18 V

With a high maximum supply voltage limit, this op-amp is suitable for a wide range of applications requiring higher power.

Maximum Operating Temperature: 70 °C

The high operating temperature limit ensures reliability in various environmental conditions.

Frequency Compensation: YES

Integrated frequency compensation helps in achieving stable performance across a wide frequency range.

Minimum Voltage Gain: 45000

A high voltage gain ensures that even small input signals are amplified for effective processing.

Minimum Operating Temperature: 0 °C

The minimum operating temperature ensures functionality in a variety of environments, including cooler conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes provide excellent corrosion resistance and enhance reliability over time.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and integration into various designs.

Maximum Seated Height: 1.75 mm

A low seated height contributes to compact design options, making it ideal for space-constrained applications.

Width: 3.9 mm

A narrow width allows for more flexibility in placement on PCBs, enhancing design options.

Micropower: YES

Micropower operation is ideal for low-power applications, extending battery life in portable devices.

Length: 4.9 mm

Short length design aids in the compactness of electronic circuits, providing more layout options.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability for standard consumer applications.

Low-Bias: YES

Low-bias characteristics enhance performance in precision applications, improving overall circuit accuracy.

Maximum Negative Supply Voltage Limit: 0 V

This specification allows the op-amp to operate efficiently in single-supply applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Support for 0V as a negative supply helps simplify design in many applications.

Nominal Unity Gain Bandwidth: 100 kHz

A unity gain bandwidth of 100 kHz supports a wide range of applications, including audio and other signal processing tasks.

Technology: CMOS

Utilizing CMOS technology provides advantages in terms of low power consumption and high integration.

Terminal Form: GULL WING

Gull wing leads make for easier soldering and provide reliable electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are fundamental components in analog processing, suitable for various applications.

Maximum Supply Current: 0.034 mA

Low supply current contributes to energy efficiency, making it ideal for battery-operated devices.

Packing Method: TAPE AND REEL

Tape and reel packaging allows for efficient handling and automation in assembly processes.

Nominal Slow Rate: 0.04 V/us

A low slow rate helps in maintaining stability and minimizes oscillations in slow-switching applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with a wide variety of PCB layouts and designs.

Technical Specifications

Operational Amplifiers (Op Amps) TS27L2BCDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

100 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

45000

Nominal Slew Rate:

0.04 V/us

Peak Bias Current:

150 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

34 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS27L2BCDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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