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THBT27012D

STMicroelectronics

THBT27012D by STMicroelectronics

STMicroelectronics THBT27012D is a silicon surge protector with 8 terminals in rectangular plastic/epoxy package. It has a max breakdown voltage of 380V and is UL recognized. Ideal for surge protection applications requiring through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,130 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,130

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-

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Vyrian

USA . 2,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,902

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-

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Anansix

USA . 852 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 981 parts In-Stock

1+ parts

$2.148

100+ parts

-

1k+ parts

$1.933

10k+ parts

-

981

$2.148

-

$1.933

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MKK Technologies

India . 306 parts In-Stock

1+ parts

$4.040

100+ parts

-

1k+ parts

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10k+ parts

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306

$4.040

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-

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DigiPath Technology Company

USA . 306 parts In-Stock

1+ parts

$4.040

100+ parts

-

1k+ parts

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10k+ parts

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306

$4.040

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-

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Corphita

USA . 2,336 parts In-Stock

1+ parts

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2,336

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Parana Technologies

USA . 1,999 parts In-Stock

1+ parts

-

100+ parts

$2.568

1k+ parts

-

10k+ parts

-

1,999

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$2.568

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Overview

With the THBT27012D by STMicroelectronics, you can trust in top-notch quality and reliability. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge solutions for Silicon Surge Protectors. This versatile product offers peace of mind and protection against voltage spikes, making it ideal for a range of applications. Experience the value and benefits of this innovative technology, ensuring your electronics stay safe and secure. Trust STMicroelectronics to provide the protection you need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection against environmental factors, making the surge protector long-lasting and reliable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy installation and integration into existing systems or equipment.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer a secure and stable connection, reducing the risk of loose connections or malfunctions.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, providing flexibility and versatility in usage.

Package Style (Meter): IN-LINE

In-line package style makes it easy to incorporate the surge protector into existing setups without taking up much space.

Trigger Device Type: SILICON SURGE PROTECTOR

Silicon surge protector offers reliable protection against voltage spikes and surges, ensuring the safety of connected equipment.

Terminal Position: DUAL

Dual terminal position allows for more secure connections and prevents potential electrical hazards or failures.

Maximum Breakdown Voltage: 380 V

High maximum breakdown voltage of 380V ensures efficient protection against high voltage surges, safeguarding connected devices.

Reference Standard: UL RECOGNIZED

Being UL recognized means the surge protector meets safety and quality standards, providing peace of mind to users regarding its reliability and performance.

Technical Specifications

Silicon Surge Protectors THBT27012D attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

380 V

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

THBT27012D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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