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TDE1898RFPT

STMicroelectronics

TDE1898RFPT by STMicroelectronics

TDE1898RFPT by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 35V and built-in protections against overcurrent, thermal issues, and undervoltage. It operates in temperatures from -25 °C to 85 °C, making it ideal for robust applications. With a compact SO package and fast switching times (turn-on: 100µs), it's perfect for buffer or inverter-based circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,567 parts In-Stock

1+ parts

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7,567

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Digiode

USA . 3,553 parts In-Stock

1+ parts

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1k+ parts

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3,553

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Anansix

USA . 2,508 parts In-Stock

1+ parts

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2,508

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,048 parts In-Stock

1+ parts

$13.148

100+ parts

-

1k+ parts

$11.833

10k+ parts

-

1,048

$13.148

-

$11.833

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AZTECH Wire

Italy . 522 parts In-Stock

1+ parts

$14.210

100+ parts

-

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522

$14.210

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MKK Technologies

India . 1,527 parts In-Stock

1+ parts

$24.723

100+ parts

-

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1,527

$24.723

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DigiPath Technology Company

USA . 1,527 parts In-Stock

1+ parts

$24.723

100+ parts

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1k+ parts

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1,527

$24.723

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Component Stockers USA

USA . 713 parts In-Stock

1+ parts

$99.990

100+ parts

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10k+ parts

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713

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,498 parts In-Stock

1+ parts

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11,498

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Microchip USA

USA . 5,792 parts In-Stock

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5,792

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Corphita

USA . 3,577 parts In-Stock

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3,577

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Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

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100+ parts

$15.720

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1,316

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$15.720

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Overview

Elevate your designs with the TDE1898RFPT from STMicroelectronics, a trusted name in quality and innovation. This versatile peripheral driver, engineered for maximum reliability, excels in applications demanding efficiency and performance. With built-in protections against overcurrent, thermal issues, and undervoltage, it ensures your systems operate safely under various conditions. Choose the TDE1898RFPT for unmatched durability and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances reliability and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards.

Maximum Supply Voltage: 35 V

A high maximum supply voltage increases versatility, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and effective thermal management.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections enhance safety and reliability, ensuring the driver operates within safe limits.

No. of Terminals: 20

Having 20 terminals provides sufficient connections for complex circuitry, allowing for flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space, allowing more components to fit on a PCB.

Minimum Supply Voltage: 18 V

The minimum supply voltage ensures effective operation in high-powered applications, boosting performance.

Maximum Operating Temperature: 85 C

A maximum operating temperature of 85 °C allows for use in varied environments, including industrial settings.

Minimum Operating Temperature: -25 C

The capability to operate at -25 °C ensures reliability in cold conditions, making it suitable for outdoor applications.

Terminal Position: DUAL

Dual terminal positioning provides flexible routing options and simplifies PCB layout.

Maximum Seated Height: 2.65 mm

A low seated height supports low-profile designs, making it ideal for compact electronic devices.

Width: 7.5 mm

A slim width allows efficient use of limited space in electronic assemblies.

Length: 12.8 mm

A moderate length balances compatibility with various PCB layouts while optimizing performance.

Temperature Grade: COMMERCIAL EXTENDED

The extended temperature range grade allows for use in more demanding environments, thus broadening application scope.

Technology: BCDMOS

BCD technology enhances performance and efficiency, making the driver suitable for power management applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improve mechanical stability, enhancing reliability.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V is optimal for numerous peripheral applications, striking a good balance between performance and power efficiency.

Turn-on Time: 100 us

A fast turn-on time of 100 microseconds increases the responsiveness of peripheral devices, making it suitable for real-time applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch supports high-density PCB designs, facilitating more compact layouts.

Nominal Output Peak Current Limit: 0.75 A

A peak current limit of 0.75A allows driving of a variety of components, ensuring robust performance in demanding scenarios.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver makes it versatile for a wide range of applications, ensuring effective signal management.

Turn-off Time: 20 us

A quick turn-off time of 20 microseconds enhances efficiency and reduces power wastage in peripheral circuits.

Output Current Flow Direction: SINK

The ability to sink current is ideal for interfacing with high-side drivers and various load types, adding to the driver's flexibility.

Technical Specifications

Peripheral Drivers TDE1898RFPT attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

18 V

Nominal Supply Voltage:

24 V

Maximum Supply Voltage-1:

35 V

Minimum Supply Voltage-1:

9 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

20 us

Turn-on Time:

100 us

Width:

7.5 mm

Trade Compliance

TDE1898RFPT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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